QMS-032-06.75-L-D-DP-PC4 Samtec
Виробник: SamtecConn Micro High Speed Terminal Strip HDR 64 POS 0.635mm Solder ST Thru-Hole/SMD Tray
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Технічний опис QMS-032-06.75-L-D-DP-PC4 Samtec
Description: CONN DIFF ARRAY PLG 64P SMD GOLD, Features: Board Guide, Ground Bus (Plane), Power Pins (8), Packaging: Tray, Connector Type: Differential Pair Array, Male, Contact Finish: Gold, Mounting Type: Surface Mount, Through Hole, Number of Positions: 72 (64 + 8 Power), Pitch: 0.025" (0.64mm), Height Above Board: 0.250" (6.35mm), Contact Finish Thickness: 10.0µin (0.25µm), Mated Stacking Heights: 11mm, 13mm, Number of Rows: 2.
Інші пропозиції QMS-032-06.75-L-D-DP-PC4
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
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QMS-032-06.75-L-D-DP-PC4 | Виробник : Samtec |
Conn Micro High Speed Terminal Strip HDR 64 POS 0.635mm Solder ST Thru-Hole/SMD Tray |
товар відсутній |
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QMS-032-06.75-L-D-DP-PC4 | Виробник : Samtec |
Conn Micro High Speed Terminal Strip HDR 64 POS 0.635mm Solder ST Thru-Hole/SMD Tray |
товар відсутній |
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| QMS-032-06.75-L-D-DP-PC4 | Виробник : Samtec Inc. |
Description: CONN DIFF ARRAY PLG 64P SMD GOLD Features: Board Guide, Ground Bus (Plane), Power Pins (8) Packaging: Tray Connector Type: Differential Pair Array, Male Contact Finish: Gold Mounting Type: Surface Mount, Through Hole Number of Positions: 72 (64 + 8 Power) Pitch: 0.025" (0.64mm) Height Above Board: 0.250" (6.35mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 11mm, 13mm Number of Rows: 2 |
товар відсутній |
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QMS-032-06.75-L-D-DP-PC4 | Виробник : Samtec |
Headers & Wire Housings 0.635 mm Q2 High-Speed Rugged Ground Plane Terminal Strip |
товар відсутній |