QSS-016-01-H-D-DP-LS2 Samtec Inc.
Виробник: Samtec Inc.
Description: CONN DIFF ARRAY RCP 32P SMD GOLD
Packaging: Tray
Features: Ground Bus (Plane), Mating Flange
Connector Type: Differential Pair Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 32
Pitch: 0.025" (0.64mm)
Height Above Board: 0.143" (3.63mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 5mm
Part Status: Active
Number of Rows: 2
Description: CONN DIFF ARRAY RCP 32P SMD GOLD
Packaging: Tray
Features: Ground Bus (Plane), Mating Flange
Connector Type: Differential Pair Array, Female
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 32
Pitch: 0.025" (0.64mm)
Height Above Board: 0.143" (3.63mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Mated Stacking Heights: 5mm
Part Status: Active
Number of Rows: 2
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Технічний опис QSS-016-01-H-D-DP-LS2 Samtec Inc.
Description: CONN DIFF ARRAY RCP 32P SMD GOLD, Packaging: Tray, Features: Ground Bus (Plane), Mating Flange, Connector Type: Differential Pair Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 32, Pitch: 0.025" (0.64mm), Height Above Board: 0.143" (3.63mm), Contact Finish Thickness: 30.0µin (0.76µm), Mated Stacking Heights: 5mm, Part Status: Active, Number of Rows: 2.
Інші пропозиції QSS-016-01-H-D-DP-LS2
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
 |
QSS-016-01-H-D-DP-LS2 | Виробник : Samtec |
 Headers & Wire Housings 0.635 mm Q Strip High-Speed Ground Plane Socket Strip |
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