Технічний опис QSS-032-01-L-D-DP Samtec
Description: CONN DIFF ARRAY RCP 64P SMD GOLD, Features: Ground Bus (Plane), Packaging: Tray, Connector Type: Differential Pair Array, Female, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 64, Pitch: 0.025" (0.64mm), Height Above Board: 0.143" (3.63mm), Contact Finish Thickness: 10.0µin (0.25µm), Mated Stacking Heights: 5mm, Number of Rows: 2.
Інші пропозиції QSS-032-01-L-D-DP
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| QSS-032-01-L-D-DP | Виробник : Samtec Inc. |
Description: CONN DIFF ARRAY RCP 64P SMD GOLD Features: Ground Bus (Plane) Packaging: Tray Connector Type: Differential Pair Array, Female Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 64 Pitch: 0.025" (0.64mm) Height Above Board: 0.143" (3.63mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 5mm Number of Rows: 2 |
товару немає в наявності |
||
 |
QSS-032-01-L-D-DP | Виробник : Samtec | Headers & Wire Housings 0.635 mm Q Strip High-Speed Ground Plane Socket Strip |
товару немає в наявності |