Технічний опис R7F7016533ABG-C#AC1 Renesas Electronics
Description: 32BIT MCU, Packaging: Tray, Package / Case: 272-FBGA, Mounting Type: Surface Mount, Speed: 240MHz, Program Memory Size: 4MB (4M x 8), RAM Size: 544K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, EEPROM Size: 128K x 8, Core Processor: RH850G3KH, Data Converters: A/D 38x10b, 32x12b, Core Size: 32-Bit, Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V, Connectivity: CANbus, CSI, FIFO, FlexRay, I²C, LINbus, SENT, UART/USART, Peripherals: DMA, LVD, PWM, WDT, Supplier Device Package: 272-FBGA (17x17), Part Status: Active, Number of I/O: 214.
Інші пропозиції R7F7016533ABG-C#AC1
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
| R7F7016533ABG-C#AC1 | Renesas Electronics America Inc |
Description: 32BIT MCU Packaging: Tray Package / Case: 272-FBGA Mounting Type: Surface Mount Speed: 240MHz Program Memory Size: 4MB (4M x 8) RAM Size: 544K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: RH850G3KH Data Converters: A/D 38x10b, 32x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, CSI, FIFO, FlexRay, I²C, LINbus, SENT, UART/USART Peripherals: DMA, LVD, PWM, WDT Supplier Device Package: 272-FBGA (17x17) Part Status: Active Number of I/O: 214 |
товару немає в наявності |
В кошику од. на суму грн. |
| R7F7016533ABG-C#AC1 |
Виробник: Renesas Electronics America Inc
Description: 32BIT MCU
Packaging: Tray
Package / Case: 272-FBGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 544K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: RH850G3KH
Data Converters: A/D 38x10b, 32x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSI, FIFO, FlexRay, I²C, LINbus, SENT, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 272-FBGA (17x17)
Part Status: Active
Number of I/O: 214
Description: 32BIT MCU
Packaging: Tray
Package / Case: 272-FBGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 544K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: RH850G3KH
Data Converters: A/D 38x10b, 32x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSI, FIFO, FlexRay, I²C, LINbus, SENT, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 272-FBGA (17x17)
Part Status: Active
Number of I/O: 214
товару немає в наявності
В кошику
од. на суму грн.