Технічний опис R7F7016533ABG-C#AC1 Renesas Electronics
Description: 32BIT MCU, Number of I/O: 214, Part Status: Active, Supplier Device Package: 272-FBGA (17x17), Peripherals: DMA, LVD, PWM, WDT, Connectivity: CANbus, CSI, FIFO, FlexRay, I²C, LINbus, SENT, UART/USART, Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V, Core Size: 32-Bit, Data Converters: A/D 38x10b, 32x12b, Core Processor: RH850G3KH, EEPROM Size: 128K x 8, Program Memory Type: FLASH, Oscillator Type: Internal, Operating Temperature: -40°C ~ 105°C (TA), RAM Size: 544K x 8, Program Memory Size: 4MB (4M x 8), Speed: 240MHz, Mounting Type: Surface Mount, Package / Case: 272-FBGA, Packaging: Tray.
Інші пропозиції R7F7016533ABG-C#AC1
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
| R7F7016533ABG-C#AC1 | Renesas Electronics America Inc |
Description: 32BIT MCU Number of I/O: 214 Part Status: Active Supplier Device Package: 272-FBGA (17x17) Peripherals: DMA, LVD, PWM, WDT Connectivity: CANbus, CSI, FIFO, FlexRay, I²C, LINbus, SENT, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 38x10b, 32x12b Core Processor: RH850G3KH EEPROM Size: 128K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 544K x 8 Program Memory Size: 4MB (4M x 8) Speed: 240MHz Mounting Type: Surface Mount Package / Case: 272-FBGA Packaging: Tray |
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| R7F7016533ABG-C#AC1 |
Виробник: Renesas Electronics America Inc
Description: 32BIT MCU
Number of I/O: 214
Part Status: Active
Supplier Device Package: 272-FBGA (17x17)
Peripherals: DMA, LVD, PWM, WDT
Connectivity: CANbus, CSI, FIFO, FlexRay, I²C, LINbus, SENT, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 38x10b, 32x12b
Core Processor: RH850G3KH
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 544K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 272-FBGA
Packaging: Tray
Description: 32BIT MCU
Number of I/O: 214
Part Status: Active
Supplier Device Package: 272-FBGA (17x17)
Peripherals: DMA, LVD, PWM, WDT
Connectivity: CANbus, CSI, FIFO, FlexRay, I²C, LINbus, SENT, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 38x10b, 32x12b
Core Processor: RH850G3KH
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 544K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 272-FBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.