RE906 ROTH ELEKTRONIK
Виробник: ROTH ELEKTRONIK
Description: ROTH ELEKTRONIK - RE906 - Adapter, SMD, Epoxidglas, 1.5mm, 13.5mm x 23.5mm
Umwandlung zu: -
Rastermaß: 0.65
Umwandlung von: -
Reihenabstand: -
Produktpalette: -
SVHC: No SVHC (17-Jan-2022)
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Технічний опис RE906 ROTH ELEKTRONIK
Description: SMD Adapter SC70 SOT23 DIP, Packaging: Bulk, Size / Dimension: 0.93" L x 0.53" W (23.50mm x 13.50mm), Pitch: 0.026" (0.65mm), Board Thickness: 0.059" (1.50mm), Proto Board Type: Breadboard, General Purpose, Hole Diameter: 0.039" (1.00mm), Circuit Pattern: Pad Per Hole (Round), Plating: Plated Through Hole (PTH).
Інші пропозиції RE906
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
RE906 | Roth Elektronik |
Description: SMD Adapter SC70 SOT23 DIP Packaging: Bulk Size / Dimension: 0.93" L x 0.53" W (23.50mm x 13.50mm) Pitch: 0.026" (0.65mm) Board Thickness: 0.059" (1.50mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) |
товару немає в наявності |
В кошику од. на суму грн. |
| RE906 |
|
Виробник: Roth Elektronik
Description: SMD Adapter SC70 SOT23 DIP
Packaging: Bulk
Size / Dimension: 0.93" L x 0.53" W (23.50mm x 13.50mm)
Pitch: 0.026" (0.65mm)
Board Thickness: 0.059" (1.50mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Description: SMD Adapter SC70 SOT23 DIP
Packaging: Bulk
Size / Dimension: 0.93" L x 0.53" W (23.50mm x 13.50mm)
Pitch: 0.026" (0.65mm)
Board Thickness: 0.059" (1.50mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
товару немає в наявності
В кошику
од. на суму грн.