RP605Z183B-E2-T Nisshinbo
Виробник: Nisshinbo
Switching Voltage Regulators 300mA Ultra-low Power Buck Boost DC/DC Converter with Battery Monitor
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 190.07 грн |
| 10+ | 138.93 грн |
| 25+ | 109.76 грн |
| 100+ | 98.03 грн |
| 250+ | 92.51 грн |
| 500+ | 74.56 грн |
| 1000+ | 71.80 грн |
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Технічний опис RP605Z183B-E2-T Nisshinbo
Description: 300MA ULTRA-LOW POWER BUCK BOOST, Packaging: Tape & Reel (TR), Package / Case: 20-XFBGA, WLCSP, Mounting Type: Surface Mount, Operating Temperature: -40°C ~ 85°C, Voltage - Supply: 1.8V ~ 5.5V, Applications: Battery Management, Power Supplies, Current - Supply: 300nA, Supplier Device Package: 20-WLCSP-P3 (2.32x1.71).
Інші пропозиції RP605Z183B-E2-T
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
RP605Z183B-E2-T | Nisshinbo Micro Devices Inc. |
Description: 300MA ULTRA-LOW POWER BUCK BOOST Packaging: Tape & Reel (TR) Package / Case: 20-XFBGA, WLCSP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 5.5V Applications: Battery Management, Power Supplies Current - Supply: 300nA Supplier Device Package: 20-WLCSP-P3 (2.32x1.71) |
товару немає в наявності |
Мінімальне замовлення: 5000 шт В кошику од. на суму грн. |
|
|
RP605Z183B-E2-T | Nisshinbo Micro Devices Inc. |
Description: 300MA ULTRA-LOW POWER BUCK BOOST Packaging: Cut Tape (CT) Package / Case: 20-XFBGA, WLCSP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.8V ~ 5.5V Applications: Battery Management, Power Supplies Current - Supply: 300nA Supplier Device Package: 20-WLCSP-P3 (2.32x1.71) |
товару немає в наявності |
В кошику од. на суму грн. |
| RP605Z183B-E2-T |
|
Виробник: Nisshinbo Micro Devices Inc.
Description: 300MA ULTRA-LOW POWER BUCK BOOST
Packaging: Tape & Reel (TR)
Package / Case: 20-XFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Applications: Battery Management, Power Supplies
Current - Supply: 300nA
Supplier Device Package: 20-WLCSP-P3 (2.32x1.71)
Description: 300MA ULTRA-LOW POWER BUCK BOOST
Packaging: Tape & Reel (TR)
Package / Case: 20-XFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Applications: Battery Management, Power Supplies
Current - Supply: 300nA
Supplier Device Package: 20-WLCSP-P3 (2.32x1.71)
товару немає в наявності
Мінімальне замовлення: 5000 шт
В кошику
од. на суму грн.
| RP605Z183B-E2-T |
|
Виробник: Nisshinbo Micro Devices Inc.
Description: 300MA ULTRA-LOW POWER BUCK BOOST
Packaging: Cut Tape (CT)
Package / Case: 20-XFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Applications: Battery Management, Power Supplies
Current - Supply: 300nA
Supplier Device Package: 20-WLCSP-P3 (2.32x1.71)
Description: 300MA ULTRA-LOW POWER BUCK BOOST
Packaging: Cut Tape (CT)
Package / Case: 20-XFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 5.5V
Applications: Battery Management, Power Supplies
Current - Supply: 300nA
Supplier Device Package: 20-WLCSP-P3 (2.32x1.71)
товару немає в наявності
В кошику
од. на суму грн.