S912ZVMC12AMKHR NXP USA Inc.
Виробник: NXP USA Inc.
Description: S12Z CORE,128K FLASH,CAN,64LQFP
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Core Size: 16-Bit
Data Converters: A/D 9x12b SAR
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Number of I/O: 31
Supplier Device Package: 64-HLQFP (10x10)
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Технічний опис S912ZVMC12AMKHR NXP USA Inc.
Description: S12Z CORE,128K FLASH,CAN,64LQFP, Peripherals: DMA, POR, PWM, WDT, Connectivity: CANbus, SCI, SPI, Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V, Core Size: 16-Bit, Data Converters: A/D 9x12b SAR, Core Processor: S12Z, EEPROM Size: 512 x 8, Program Memory Type: FLASH, Oscillator Type: External, Internal, Operating Temperature: -40°C ~ 125°C (TA), RAM Size: 8K x 8, Program Memory Size: 128KB (128K x 8), Speed: 50MHz, Mounting Type: Surface Mount, Package / Case: 64-LQFP Exposed Pad, Packaging: Tape & Reel (TR), Number of I/O: 31, Supplier Device Package: 64-HLQFP (10x10).