SEAFP-50-01-S-10-RA-WT-GP Samtec
Виробник: Samtec
Board to Board & Mezzanine Connectors .050 SEARAY High-Speed Open-Pin-Field Array Socket
| Кількість | Ціна |
|---|---|
| 1+ | 3608.11 грн |
| 10+ | 3367.05 грн |
| 42+ | 2862.93 грн |
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Технічний опис SEAFP-50-01-S-10-RA-WT-GP Samtec
Description: .050" SEARAY HIGH-SPEED OPEN-PI, Features: Board Guide, Solder Retention, Packaging: Tray, Connector Type: High Density Array, Female, Contact Finish: Gold, Mounting Type: Through Hole, Right Angle, Press-Fit, Number of Positions: 500, Pitch: 0.050" (1.27mm), Contact Finish Thickness: 30.0µin (0.76µm), Number of Rows: 10.
Інші пропозиції SEAFP-50-01-S-10-RA-WT-GP
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
|
SEAFP-50-01-S-10-RA-WT-GP | Samtec Inc. |
Description: .050" SEARAY HIGH-SPEED OPEN-PIFeatures: Board Guide, Solder Retention Packaging: Tray Connector Type: High Density Array, Female Contact Finish: Gold Mounting Type: Through Hole, Right Angle, Press-Fit Number of Positions: 500 Pitch: 0.050" (1.27mm) Contact Finish Thickness: 30.0µin (0.76µm) Number of Rows: 10 |
товару немає в наявності |
Мінімальне замовлення: 21 шт В кошику од. на суму грн. |
| SEAFP-50-01-S-10-RA-WT-GP |
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Виробник: Samtec Inc.
Description: .050" SEARAY HIGH-SPEED OPEN-PI
Features: Board Guide, Solder Retention
Packaging: Tray
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Through Hole, Right Angle, Press-Fit
Number of Positions: 500
Pitch: 0.050" (1.27mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Number of Rows: 10
Description: .050" SEARAY HIGH-SPEED OPEN-PI
Features: Board Guide, Solder Retention
Packaging: Tray
Connector Type: High Density Array, Female
Contact Finish: Gold
Mounting Type: Through Hole, Right Angle, Press-Fit
Number of Positions: 500
Pitch: 0.050" (1.27mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Number of Rows: 10
товару немає в наявності
Мінімальне замовлення: 21 шт
В кошику
од. на суму грн.



