SEAMP-20-02.0-L-06 Samtec Inc.
Виробник: Samtec Inc.
Description: CONN HD ARRAY M 120POS PRESS-FIT
Number of Rows: 6
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.181" (4.60mm)
Pitch: 0.050" (1.27mm)
Number of Positions: 120
Mounting Type: Through Hole
Contact Finish: Gold
Connector Type: High Density Array, Male
Packaging: Tray
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Технічний опис SEAMP-20-02.0-L-06 Samtec Inc.
Description: CONN HD ARRAY M 120POS PRESS-FIT, Number of Rows: 6, Mated Stacking Heights: 7mm, 8mm, 8.5mm, Contact Finish Thickness: 10.0µin (0.25µm), Height Above Board: 0.181" (4.60mm), Pitch: 0.050" (1.27mm), Number of Positions: 120, Mounting Type: Through Hole, Contact Finish: Gold, Connector Type: High Density Array, Male, Packaging: Tray.
Інші пропозиції SEAMP-20-02.0-L-06
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
|
SEAMP-20-02.0-L-06 | Samtec Inc. |
Description: CONN HD ARRAY M 120POS PRESS-FITNumber of Rows: 6 Mated Stacking Heights: 7mm, 8mm, 8.5mm Contact Finish Thickness: 10.0µin (0.25µm) Height Above Board: 0.181" (4.60mm) Pitch: 0.050" (1.27mm) Number of Positions: 120 Mounting Type: Through Hole Contact Finish: Gold Connector Type: High Density Array, Male Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
|
SEAMP-20-02.0-L-06 | Samtec |
Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal |
товару немає в наявності |
В кошику од. на суму грн. |
| SEAMP-20-02.0-L-06 |
![]() |
Виробник: Samtec Inc.
Description: CONN HD ARRAY M 120POS PRESS-FIT
Number of Rows: 6
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.181" (4.60mm)
Pitch: 0.050" (1.27mm)
Number of Positions: 120
Mounting Type: Through Hole
Contact Finish: Gold
Connector Type: High Density Array, Male
Packaging: Tray
Description: CONN HD ARRAY M 120POS PRESS-FIT
Number of Rows: 6
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Contact Finish Thickness: 10.0µin (0.25µm)
Height Above Board: 0.181" (4.60mm)
Pitch: 0.050" (1.27mm)
Number of Positions: 120
Mounting Type: Through Hole
Contact Finish: Gold
Connector Type: High Density Array, Male
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| SEAMP-20-02.0-L-06 |
![]() |
Виробник: Samtec
Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
товару немає в наявності
В кошику
од. на суму грн.


