SEAMP-20-02.0-S-08-GP Samtec
Виробник: Samtec
Board to Board & Mezzanine Connectors .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
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Технічний опис SEAMP-20-02.0-S-08-GP Samtec
Description: CONN HD ARRAY M 160POS PRESS-FIT, Pitch: 0.050" (1.27mm), Number of Positions: 160, Mounting Type: Through Hole, Contact Finish: Gold, Connector Type: High Density Array, Male, Features: Board Guide, Packaging: Tube, Mated Stacking Heights: 7mm, 8mm, 8.5mm, Contact Finish Thickness: 30.0µin (0.76µm), Number of Rows: 8, Height Above Board: 0.181" (4.60mm).
Інші пропозиції SEAMP-20-02.0-S-08-GP
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
 |
SEAMP-20-02.0-S-08-GP | Samtec Inc. |
Description: CONN HD ARRAY M 160POS PRESS-FIT Pitch: 0.050" (1.27mm) Number of Positions: 160 Mounting Type: Through Hole Contact Finish: Gold Connector Type: High Density Array, Male Features: Board Guide Packaging: Tube Mated Stacking Heights: 7mm, 8mm, 8.5mm Contact Finish Thickness: 30.0µin (0.76µm) Number of Rows: 8 Height Above Board: 0.181" (4.60mm) |
товару немає в наявності |
В кошику од. на суму грн. |
| SEAMP-20-02.0-S-08-GP |
|
Виробник: Samtec Inc.
Description: CONN HD ARRAY M 160POS PRESS-FIT
Pitch: 0.050" (1.27mm)
Number of Positions: 160
Mounting Type: Through Hole
Contact Finish: Gold
Connector Type: High Density Array, Male
Features: Board Guide
Packaging: Tube
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Contact Finish Thickness: 30.0µin (0.76µm)
Number of Rows: 8
Height Above Board: 0.181" (4.60mm)
Description: CONN HD ARRAY M 160POS PRESS-FIT
Pitch: 0.050" (1.27mm)
Number of Positions: 160
Mounting Type: Through Hole
Contact Finish: Gold
Connector Type: High Density Array, Male
Features: Board Guide
Packaging: Tube
Mated Stacking Heights: 7mm, 8mm, 8.5mm
Contact Finish Thickness: 30.0µin (0.76µm)
Number of Rows: 8
Height Above Board: 0.181" (4.60mm)
товару немає в наявності
В кошику
од. на суму грн.