SEM-105-02-03.0-H-D-WT Samtec
на замовлення 246 шт:
термін постачання 21-30 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 451.24 грн |
| 10+ | 400.57 грн |
| 100+ | 321.47 грн |
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Технічний опис SEM-105-02-03.0-H-D-WT Samtec
Description: CONN RCPT 10POS 0.031 GOLD SMD, Features: Solder Retention, Packaging: Tray, Connector Type: Receptacle, Current Rating (Amps): 2.6A per Contact, Mounting Type: Surface Mount, Number of Positions: 10, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Mated Stacking Heights: 6mm, 7mm, 10mm, Insulation Color: Black, Pitch - Mating: 0.031" (0.80mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Gold, Insulation Height: 0.177" (4.50mm), Row Spacing - Mating: 0.125" (3.18mm), Number of Rows: 2.
Інші пропозиції SEM-105-02-03.0-H-D-WT за ціною від 455.47 грн до 627.19 грн
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SEM-105-02-03.0-H-D-WT | Виробник : Samtec Inc. |
 Description: CONN RCPT 10POS 0.031 GOLD SMDFeatures: Solder Retention Packaging: Tray Connector Type: Receptacle Current Rating (Amps): 2.6A per Contact Mounting Type: Surface Mount Number of Positions: 10 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Mated Stacking Heights: 6mm, 7mm, 10mm Insulation Color: Black Pitch - Mating: 0.031" (0.80mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Gold Insulation Height: 0.177" (4.50mm) Row Spacing - Mating: 0.125" (3.18mm) Number of Rows: 2 |
на замовлення 291 шт: термін постачання 21-31 дні (днів) |
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