SEM-110-02-03.0-H-D-WT Samtec
| Кількість | Ціна |
|---|---|
| 1+ | 534.83 грн |
| 10+ | 487.01 грн |
| 25+ | 400.43 грн |
| 50+ | 385.75 грн |
| 108+ | 304.69 грн |
| 540+ | 297.00 грн |
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Технічний опис SEM-110-02-03.0-H-D-WT Samtec
Description: CONN RCPT 20POS 0.031 GOLD SMD, Features: Solder Retention, Packaging: Tray, Connector Type: Receptacle, Current Rating (Amps): 2.6A per Contact, Mounting Type: Surface Mount, Number of Positions: 20, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Mated Stacking Heights: 6mm, 7mm, 10mm, Insulation Color: Black, Pitch - Mating: 0.031" (0.80mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Gold, Insulation Height: 0.177" (4.50mm), Row Spacing - Mating: 0.125" (3.18mm), Number of Rows: 2.
Інші пропозиції SEM-110-02-03.0-H-D-WT за ціною від 379.46 грн до 593.56 грн
| Фото | Назва | Виробник | Інформація |
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SEM-110-02-03.0-H-D-WT | Виробник : Samtec |
 Conn Micro Socket Strip SKT 20 POS 0.8mm Solder ST Top Entry SMD Tray |
на замовлення 108 шт: термін постачання 21-31 дні (днів) |
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SEM-110-02-03.0-H-D-WT | Виробник : Samtec Inc. |
Description: CONN RCPT 20POS 0.031 GOLD SMD Features: Solder Retention Packaging: Tray Connector Type: Receptacle Current Rating (Amps): 2.6A per Contact Mounting Type: Surface Mount Number of Positions: 20 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Mated Stacking Heights: 6mm, 7mm, 10mm Insulation Color: Black Pitch - Mating: 0.031" (0.80mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Gold Insulation Height: 0.177" (4.50mm) Row Spacing - Mating: 0.125" (3.18mm) Number of Rows: 2 |
на замовлення 115 шт: термін постачання 21-31 дні (днів) |
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