SEM-115-02-03.0-H-D-WT Samtec Inc.

Description: CONN RCPT 30POS 0.031 GOLD SMD, Packaging: Tray, Features: Solder Retention, Connector Type: Receptacle, Current Rating (Amps): 2.6A per Contact, Mounting Type: Surface Mount, Number of Positions: 30, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Mated Stacking Heights: 6mm, 7mm, 10mm, Insulation Color: Black, Pitch - Mating: 0.031" (0.80mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Gold, Part Status: Active, Insulation Height: 0.177" (4.50mm), Row Spacing - Mating: 0.125" (3.18mm), Number of Rows: 2.