SEM-120-02-03.0-H-D-WT Samtec
| Кількість | Ціна |
|---|---|
| 1+ | 858.65 грн |
| 10+ | 782.14 грн |
| 25+ | 677.33 грн |
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Технічний опис SEM-120-02-03.0-H-D-WT Samtec
Description: CONN RCPT 40POS 0.031 GOLD SMD, Features: Solder Retention, Packaging: Tray, Connector Type: Receptacle, Current Rating (Amps): 2.6A per Contact, Mounting Type: Surface Mount, Number of Positions: 40, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Mated Stacking Heights: 6mm, 7mm, 10mm, Insulation Color: Black, Pitch - Mating: 0.031" (0.80mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Gold, Insulation Height: 0.177" (4.50mm), Row Spacing - Mating: 0.125" (3.18mm), Number of Rows: 2.
Інші пропозиції SEM-120-02-03.0-H-D-WT
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
|
SEM-120-02-03.0-H-D-WT | Samtec Inc. |
Description: CONN RCPT 40POS 0.031 GOLD SMDFeatures: Solder Retention Packaging: Tray Connector Type: Receptacle Current Rating (Amps): 2.6A per Contact Mounting Type: Surface Mount Number of Positions: 40 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Mated Stacking Heights: 6mm, 7mm, 10mm Insulation Color: Black Pitch - Mating: 0.031" (0.80mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Gold Insulation Height: 0.177" (4.50mm) Row Spacing - Mating: 0.125" (3.18mm) Number of Rows: 2 |
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| SEM-120-02-03.0-H-D-WT |
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Виробник: Samtec Inc.
Description: CONN RCPT 40POS 0.031 GOLD SMD
Features: Solder Retention
Packaging: Tray
Connector Type: Receptacle
Current Rating (Amps): 2.6A per Contact
Mounting Type: Surface Mount
Number of Positions: 40
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Mated Stacking Heights: 6mm, 7mm, 10mm
Insulation Color: Black
Pitch - Mating: 0.031" (0.80mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Insulation Height: 0.177" (4.50mm)
Row Spacing - Mating: 0.125" (3.18mm)
Number of Rows: 2
Description: CONN RCPT 40POS 0.031 GOLD SMD
Features: Solder Retention
Packaging: Tray
Connector Type: Receptacle
Current Rating (Amps): 2.6A per Contact
Mounting Type: Surface Mount
Number of Positions: 40
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Mated Stacking Heights: 6mm, 7mm, 10mm
Insulation Color: Black
Pitch - Mating: 0.031" (0.80mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Insulation Height: 0.177" (4.50mm)
Row Spacing - Mating: 0.125" (3.18mm)
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.




