SM3ZS067U215BBR1500 JAE Electronics

Description: Interconnect Rectangular
Features: Board Guide, Solder Retention
Packaging: Bulk
Gender: Female
Contact Finish: Gold
Mounting Type: Free Hanging (In-Line)
Number of Positions: 67
Pitch: 0.020" (0.50mm)
Operating Temperature: -40°C ~ 80°C
Read Out: Single
Card Type: Non Specified - Dual Edge
Card Thickness: 0.031" (0.79mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Copper Alloy
Number of Positions/Bay/Row: 67
Number of Rows: 2
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Технічний опис SM3ZS067U215BBR1500 JAE Electronics
Description: Interconnect Rectangular, Features: Board Guide, Solder Retention, Packaging: Bulk, Gender: Female, Contact Finish: Gold, Mounting Type: Free Hanging (In-Line), Number of Positions: 67, Pitch: 0.020" (0.50mm), Operating Temperature: -40°C ~ 80°C, Read Out: Single, Card Type: Non Specified - Dual Edge, Card Thickness: 0.031" (0.79mm), Termination: Solder, Contact Finish Thickness: 10.0µin (0.25µm), Contact Material: Copper Alloy, Number of Positions/Bay/Row: 67, Number of Rows: 2.
Інші пропозиції SM3ZS067U215BBR1500
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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SM3ZS067U215BBR1500 | Виробник : JAE Electronics |
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товару немає в наявності |