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Технічний опис SMD2SW.031 8OZ Chip Quik
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL, Packaging: Bulk, Diameter: 0.031" (0.79mm), Wire Gauge: 20 AWG, 22 SWG, Composition: Sn60Pb40 (60/40), Type: Wire Solder, Melting Point: 361 ~ 370°F (183 ~ 188°C), Form: Spool, 8 oz (227g), 1/2 lb, Process: Leaded, Flux Type: No-Clean, Water Soluble, Part Status: Active.
Інші пропозиції SMD2SW.031 8OZ
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
 |
SMD2SW.031 8OZ | Chip Quik Inc. |
 Description: SOLDER WIRE 60/40 TIN/LEAD NO-CLPackaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
| SMD2SW.031 8OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.