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Технічний опис SMD4300SNL10T5 Chip Quik
Description: SLD PASTE LF WATER SOL T5 10CC, Packaging: Dispenser, Shelf Life: 6 Months, Shelf Life Start: Date of Manufacture, Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C), Part Status: Active, Flux Type: No-Clean, Water Soluble, Process: Lead Free, Mesh Type: 5, Form: Syringe, 1.23 oz (35g), 10cc, Melting Point: 423 ~ 428°F (217 ~ 220°C), Type: Solder Paste, Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5).
Інші пропозиції SMD4300SNL10T5
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
|---|---|---|---|---|---|
 |
SMD4300SNL10T5 | Chip Quik Inc. |
 Description: SLD PASTE LF WATER SOL T5 10CCPackaging: Dispenser Shelf Life: 6 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Part Status: Active Flux Type: No-Clean, Water Soluble Process: Lead Free Mesh Type: 5 Form: Syringe, 1.23 oz (35g), 10cc Melting Point: 423 ~ 428°F (217 ~ 220°C) Type: Solder Paste Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
товару немає в наявності |
В кошику од. на суму грн. |
| SMD4300SNL10T5 |
|
Виробник: Chip Quik Inc.
Description: SLD PASTE LF WATER SOL T5 10CC
Packaging: Dispenser
Shelf Life: 6 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Mesh Type: 5
Form: Syringe, 1.23 oz (35g), 10cc
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Solder Paste
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Description: SLD PASTE LF WATER SOL T5 10CC
Packaging: Dispenser
Shelf Life: 6 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Mesh Type: 5
Form: Syringe, 1.23 oz (35g), 10cc
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Type: Solder Paste
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
товару немає в наявності
В кошику
од. на суму грн.