Технічний опис SP2-200x100-G BusBoard Prototype Systems
Description: SMTPADS-2 200X100MIL PADS, TOP-S, Packaging: Bag, Size / Dimension: 3.94" L x 3.15" W (100.1mm x 80.0mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: Breadboard, General Purpose, Circuit Pattern: Pad Per Hole (Rectangular), Plating: Non-Plated Through Hole (NPTH).
Інші пропозиції SP2-200x100-G
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
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SP2-200x100-G | BusBoard Prototype Systems |
 Description: SMTPADS-2 200X100MIL PADS, TOP-SPackaging: Bag Size / Dimension: 3.94" L x 3.15" W (100.1mm x 80.0mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Circuit Pattern: Pad Per Hole (Rectangular) Plating: Non-Plated Through Hole (NPTH) |
товару немає в наявності |
В кошику од. на суму грн. |
| SP2-200x100-G |
|
Виробник: BusBoard Prototype Systems
Description: SMTPADS-2 200X100MIL PADS, TOP-S
Packaging: Bag
Size / Dimension: 3.94" L x 3.15" W (100.1mm x 80.0mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Circuit Pattern: Pad Per Hole (Rectangular)
Plating: Non-Plated Through Hole (NPTH)
Description: SMTPADS-2 200X100MIL PADS, TOP-S
Packaging: Bag
Size / Dimension: 3.94" L x 3.15" W (100.1mm x 80.0mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Circuit Pattern: Pad Per Hole (Rectangular)
Plating: Non-Plated Through Hole (NPTH)
товару немає в наявності
В кошику
од. на суму грн.