SP3T-50X50-G-PTH BusBoard Prototype Systems
Виробник: BusBoard Prototype Systems
Description: 50X50MIL PLATED HOLE, 1/32" THIN
Plating: Plated Through Hole (PTH)
Circuit Pattern: Pad Per Hole (Square)
Hole Diameter: 0.031" (0.79mm)
Proto Board Type: Breadboard, Surface Mount
Board Thickness: 0.031" (0.79mm) 1/32"
Pitch: 0.100" (2.54mm), 0.200" (5.08mm)
Size / Dimension: 6.30" L x 3.90" W (160.0mm x 99.1mm)
Packaging: Bag
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Технічний опис SP3T-50X50-G-PTH BusBoard Prototype Systems
Description: 50X50MIL PLATED HOLE, 1/32" THIN, Plating: Plated Through Hole (PTH), Circuit Pattern: Pad Per Hole (Square), Hole Diameter: 0.031" (0.79mm), Proto Board Type: Breadboard, Surface Mount, Board Thickness: 0.031" (0.79mm) 1/32", Pitch: 0.100" (2.54mm), 0.200" (5.08mm), Size / Dimension: 6.30" L x 3.90" W (160.0mm x 99.1mm), Packaging: Bag.
Інші пропозиції SP3T-50X50-G-PTH
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
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SP3T-50X50-G-PTH | BusBoard Prototype Systems |
PCBs & Breadboards SMTpads-3U-Thin - 50x50mil Pads, Top-side Pads/Bottom-side Ground Plane, Plated Holes, 1/32" Thin, Size3 (160 x 100mm) |
на замовлення 15 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. |
| SP3T-50X50-G-PTH |
|
Виробник: BusBoard Prototype Systems
PCBs & Breadboards SMTpads-3U-Thin - 50x50mil Pads, Top-side Pads/Bottom-side Ground Plane, Plated Holes, 1/32" Thin, Size3 (160 x 100mm)
PCBs & Breadboards SMTpads-3U-Thin - 50x50mil Pads, Top-side Pads/Bottom-side Ground Plane, Plated Holes, 1/32" Thin, Size3 (160 x 100mm)
на замовлення 15 шт:
термін постачання 21-30 дні (днів)