Технічний опис ST33KTPM2IWLBZA9 STMicroelectronics
Description: OEM TPM CHIP_AU_DM, Packaging: Bulk, Package / Case: 24-XFBGA, WLCSP, Mounting Type: Surface Mount, Interface: I2C, SPI, Operating Temperature: -40°C ~ 105°C (TA), Voltage - Supply: 1.8V, 3.3V, Controller Series: ST33K, Applications: Trusted Platform Module (TPM), Core Processor: ARM® SecurCore® SC300, Supplier Device Package: 24-WLCSP (1.81x2.59), Number of I/O: 7.
Інші пропозиції ST33KTPM2IWLBZA9
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| ST33KTPM2IWLBZA9 | Виробник : STMicroelectronics |
 Description: OEM TPM CHIP_AU_DMPackaging: Bulk Package / Case: 24-XFBGA, WLCSP Mounting Type: Surface Mount Interface: I2C, SPI Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 1.8V, 3.3V Controller Series: ST33K Applications: Trusted Platform Module (TPM) Core Processor: ARM® SecurCore® SC300 Supplier Device Package: 24-WLCSP (1.81x2.59) Number of I/O: 7 |
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