T1M-03-F-SV-L Samtec Inc.
Виробник: Samtec Inc.Description: CONN HEADER SMD 3POS 1MM
Packaging: Cut Tape (CT)
Connector Type: Header
Voltage Rating: 250VAC, 353VDC
Current Rating (Amps): 3.3A per Contact
Mounting Type: Surface Mount
Number of Positions: 3
Number of Rows: 1
Style: Board to Cable/Wire
Operating Temperature: -55°C ~ 85°C
Contact Type: Male Pin
Fastening Type: Locking Ramp
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.217" (5.51mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
на замовлення 615 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 2+ | 211.97 грн |
| 50+ | 166.41 грн |
| 100+ | 141.03 грн |
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Технічний опис T1M-03-F-SV-L Samtec Inc.
Description: CONN HEADER SMD 3POS 1MM, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 250VAC, 353VDC, Current Rating (Amps): 3.3A per Contact, Mounting Type: Surface Mount, Number of Positions: 3, Number of Rows: 1, Style: Board to Cable/Wire, Operating Temperature: -55°C ~ 85°C, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Natural, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.217" (5.51mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP).
Інші пропозиції T1M-03-F-SV-L за ціною від 119.63 грн до 250.28 грн
| Фото | Назва | Виробник | Інформація |
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T1M-03-F-SV-L | Виробник : Samtec |
Headers & Wire Housings Discrete Wire Terminal Strip, 1.00 mm Pitch |
на замовлення 2812 шт: термін постачання 21-30 дні (днів) |
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T1M-03-F-SV-L | Виробник : SAMTEC |
Description: SAMTEC - T1M-03-F-SV-L - Stiftleiste, Wire-to-Board, 1 mm, 1 Reihe(n), 3 Kontakt(e), Oberflächenmontage, gerade, T1M tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 3Contacts euEccn: NLR Steckverbindersysteme: Wire-to-Board Produktpalette: T1M productTraceability: No Kontaktanschluss: Oberflächenmontage, gerade Anzahl der Reihen: 1Reihe(n) Rastermaß: 1mm SVHC: No SVHC (23-Jan-2024) |
на замовлення 25 шт: термін постачання 21-31 дні (днів) |
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T1M-03-F-SV-L | Виробник : Samtec Inc. |
Description: CONN HEADER SMD 3POS 1MM Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 250VAC, 353VDC Current Rating (Amps): 3.3A per Contact Mounting Type: Surface Mount Number of Positions: 3 Number of Rows: 1 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 85°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Natural Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.217" (5.51mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) |
товару немає в наявності |