T1M-10-GF-DV-K SAMTEC
Виробник: SAMTEC
Description: SAMTEC - T1M-10-GF-DV-K - Stiftleiste, Wire-to-Board, 1 mm, 2 Reihe(n), 20 Kontakt(e), Oberflächenmontage, gerade, T1M
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
usEccn: EAR99
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 20Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Wire-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: T1M
productTraceability: No
Kontaktanschluss: Oberflächenmontage, gerade
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1mm
SVHC: No SVHC (25-Jun-2025)
| Кількість | Ціна |
|---|---|
| 4+ | 262.52 грн |
| 10+ | 233.17 грн |
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Технічний опис T1M-10-GF-DV-K SAMTEC
Description: CONN HEADER SMD 20POS 1MM, Packaging: Tape & Reel (TR), Features: Pick and Place, Connector Type: Header, Voltage Rating: 250VAC, 353VDC, Current Rating (Amps): 3.3A per Contact, Mounting Type: Surface Mount, Number of Positions: 20, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -55°C ~ 85°C, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Natural, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Gold, Contact Shape: Square, Insulation Height: 0.268" (6.80mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.077" (1.96mm).
Інші пропозиції T1M-10-GF-DV-K за ціною від 244.17 грн до 338.06 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна | ||||||||||
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T1M-10-GF-DV-K | Виробник : Samtec Inc. |
Description: CONN HEADER SMD 20POS 1MM Packaging: Cut Tape (CT) Features: Pick and Place Connector Type: Header Voltage Rating: 250VAC, 353VDC Current Rating (Amps): 3.3A per Contact Mounting Type: Surface Mount Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 85°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Natural Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Gold Contact Shape: Square Insulation Height: 0.268" (6.80mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.077" (1.96mm) |
на замовлення 227 шт: термін постачання 21-31 дні (днів) |
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T1M-10-GF-DV-K | Виробник : Samtec |
Headers & Wire Housings 1.00 mm Discrete Wire Terminal Strip |
на замовлення 119 шт: термін постачання 21-30 дні (днів) |
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T1M-10-GF-DV-K | Виробник : Samtec Inc. |
Description: CONN HEADER SMD 20POS 1MM Packaging: Tape & Reel (TR) Features: Pick and Place Connector Type: Header Voltage Rating: 250VAC, 353VDC Current Rating (Amps): 3.3A per Contact Mounting Type: Surface Mount Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 85°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Natural Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Gold Contact Shape: Square Insulation Height: 0.268" (6.80mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.077" (1.96mm) |
товару немає в наявності |