T1M-10-GF-DV SAMTEC
Виробник: SAMTECDescription: SAMTEC - T1M-10-GF-DV - Stiftleiste, Wire-to-Board, 1 mm, 2 Reihe(n), 20 Kontakt(e), Oberflächenmontage, gerade, T1M
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
usEccn: EAR99
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 20Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Wire-to-Board
Steckverbindertyp: PCB-Stiftleiste
Produktpalette: T1M
productTraceability: No
Kontaktanschluss: Oberflächenmontage, gerade
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 1mm
SVHC: No SVHC (21-Jan-2025)
на замовлення 58 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 3+ | 312.78 грн |
| 10+ | 236.86 грн |
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Технічний опис T1M-10-GF-DV SAMTEC
Description: CONN HEADER SMD 20POS 1MM, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 250VAC, 353VDC, Current Rating (Amps): 3.3A per Contact, Mounting Type: Surface Mount, Number of Positions: 20, Number of Rows: 2, Style: Board to Cable/Wire, Operating Temperature: -55°C ~ 85°C, Contact Type: Male Pin, Fastening Type: Locking Ramp, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Natural, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Gold, Part Status: Active, Contact Shape: Square, Insulation Height: 0.268" (6.80mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.077" (1.96mm).
Інші пропозиції T1M-10-GF-DV за ціною від 355.26 грн до 501.36 грн
| Фото | Назва | Виробник | Інформація |
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T1M-10-GF-DV | Виробник : Samtec Inc. |
Description: CONN HEADER SMD 20POS 1MM Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 250VAC, 353VDC Current Rating (Amps): 3.3A per Contact Mounting Type: Surface Mount Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 85°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Natural Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Gold Part Status: Active Contact Shape: Square Insulation Height: 0.268" (6.80mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.077" (1.96mm) |
на замовлення 849 шт: термін постачання 21-31 дні (днів) |
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T1M-10-GF-DV | Виробник : Samtec Inc. |
Description: CONN HEADER SMD 20POS 1MM Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 250VAC, 353VDC Current Rating (Amps): 3.3A per Contact Mounting Type: Surface Mount Number of Positions: 20 Number of Rows: 2 Style: Board to Cable/Wire Operating Temperature: -55°C ~ 85°C Contact Type: Male Pin Fastening Type: Locking Ramp Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Natural Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Gold Part Status: Active Contact Shape: Square Insulation Height: 0.268" (6.80mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.077" (1.96mm) |
на замовлення 904 шт: термін постачання 21-31 дні (днів) |
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T1M-10-GF-DV | Виробник : Samtec |
Headers & Wire Housings 1.00 mm Discrete Wire Terminal Strip |
на замовлення 356 шт: термін постачання 21-30 дні (днів) |