TC4D9XP20MF500MCABKXUMA1 Infineon Technologies
Виробник: Infineon Technologies
Description: AURIX 3G-ACEE
Packaging: Tape & Reel (TR)
Package / Case: 672-FBGA
Mounting Type: Surface Mount
Speed: 500MHz
Program Memory Size: 20MB (20M x 8)
RAM Size: 10M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Data Converters: A/D 64 SAR
Core Size: 32-Bit12
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, C2Slb, I2C, SCI, SPI
Supplier Device Package: PG-F2HBGA-436
Grade: Automotive
Qualification: AEC-Q100
Description: AURIX 3G-ACEE
Packaging: Tape & Reel (TR)
Package / Case: 672-FBGA
Mounting Type: Surface Mount
Speed: 500MHz
Program Memory Size: 20MB (20M x 8)
RAM Size: 10M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Data Converters: A/D 64 SAR
Core Size: 32-Bit12
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, C2Slb, I2C, SCI, SPI
Supplier Device Package: PG-F2HBGA-436
Grade: Automotive
Qualification: AEC-Q100
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Технічний опис TC4D9XP20MF500MCABKXUMA1 Infineon Technologies
Description: AURIX 3G-ACEE, Packaging: Tape & Reel (TR), Package / Case: 672-FBGA, Mounting Type: Surface Mount, Speed: 500MHz, Program Memory Size: 20MB (20M x 8), RAM Size: 10M x 8, Operating Temperature: -40°C ~ 125°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: TriCore™, Data Converters: A/D 64 SAR, Core Size: 32-Bit12, Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V, Connectivity: CANbus, C2Slb, I2C, SCI, SPI, Supplier Device Package: PG-F2HBGA-436, Grade: Automotive, Qualification: AEC-Q100.