TDA4VM88TGBALFR Texas Instruments
Виробник: Texas Instruments
Description: NEXT GENERATION SOC FAMILY FOR L
Packaging: Tape & Reel (TR)
Package / Case: 827-BFBGA, FCBGA
Speed: 2GHz, 1GHz, 1.35GHz, 1GHz
RAM Size: 1.5MB
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 827-FCBGA (24x24)
Architecture: DSP, MCU, MPU
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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Технічний опис TDA4VM88TGBALFR Texas Instruments
Description: NEXT GENERATION SOC FAMILY FOR L, Packaging: Tape & Reel (TR), Package / Case: 827-BFBGA, FCBGA, Speed: 2GHz, 1GHz, 1.35GHz, 1GHz, RAM Size: 1.5MB, Operating Temperature: -40°C ~ 105°C (TJ), Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x, Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB, Peripherals: DMA, PWM, WDT, Supplier Device Package: 827-FCBGA (24x24), Architecture: DSP, MCU, MPU, Grade: Automotive, Part Status: Active, Qualification: AEC-Q100.
Інші пропозиції TDA4VM88TGBALFR за ціною від 9196.30 грн до 11752.93 грн
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||
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TDA4VM88TGBALFR | Texas Instruments |
Description: NEXT GENERATION SOC FAMILY FOR L Packaging: Cut Tape (CT) Package / Case: 827-BFBGA, FCBGA Speed: 2GHz, 1GHz, 1.35GHz, 1GHz RAM Size: 1.5MB Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB Peripherals: DMA, PWM, WDT Supplier Device Package: 827-FCBGA (24x24) Architecture: DSP, MCU, MPU Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
на замовлення 489 шт: термін постачання 21-31 дні (днів) |
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TDA4VM88TGBALFR | Texas Instruments |
Microprocessors - MPU Dual Arm Cortex -A7 2 SoC and C7x DSP wi |
на замовлення 229 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. |
| TDA4VM88TGBALFR |
|
Виробник: Texas Instruments
Description: NEXT GENERATION SOC FAMILY FOR L
Packaging: Cut Tape (CT)
Package / Case: 827-BFBGA, FCBGA
Speed: 2GHz, 1GHz, 1.35GHz, 1GHz
RAM Size: 1.5MB
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 827-FCBGA (24x24)
Architecture: DSP, MCU, MPU
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: NEXT GENERATION SOC FAMILY FOR L
Packaging: Cut Tape (CT)
Package / Case: 827-BFBGA, FCBGA
Speed: 2GHz, 1GHz, 1.35GHz, 1GHz
RAM Size: 1.5MB
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
Connectivity: MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 827-FCBGA (24x24)
Architecture: DSP, MCU, MPU
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
на замовлення 489 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 11752.93 грн |
| 10+ | 9620.07 грн |
| 25+ | 9196.30 грн |
| TDA4VM88TGBALFR |
|
Виробник: Texas Instruments
Microprocessors - MPU Dual Arm Cortex -A7 2 SoC and C7x DSP wi
Microprocessors - MPU Dual Arm Cortex -A7 2 SoC and C7x DSP wi
на замовлення 229 шт:
термін постачання 21-30 дні (днів)