TDF8555J/N2,112 NXP USA Inc.
Виробник: NXP USA Inc.
Description: IC AMPLIFIER DBS37P
Packaging: Tube
Package / Case: 37-SSIP Formed Leads
Output Type: 4 Half Bridge
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 1 @ 2Ohm; 45W x 2 @ 4Ohm
Supplier Device Package: 37-PDBS
Part Status: Obsolete
Description: IC AMPLIFIER DBS37P
Packaging: Tube
Package / Case: 37-SSIP Formed Leads
Output Type: 4 Half Bridge
Mounting Type: Through Hole
Type: Class AB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 64W x 1 @ 2Ohm; 45W x 2 @ 4Ohm
Supplier Device Package: 37-PDBS
Part Status: Obsolete
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Технічний опис TDF8555J/N2,112 NXP USA Inc.
Description: IC AMPLIFIER DBS37P, Packaging: Tube, Package / Case: 37-SSIP Formed Leads, Output Type: 4 Half Bridge, Mounting Type: Through Hole, Type: Class AB, Operating Temperature: -40°C ~ 105°C (TA), Voltage - Supply: 6V ~ 18V, Max Output Power x Channels @ Load: 64W x 1 @ 2Ohm; 45W x 2 @ 4Ohm, Supplier Device Package: 37-PDBS, Part Status: Obsolete.
Інші пропозиції TDF8555J/N2,112
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
 |
TDF8555J/N2,112 | Виробник : NXP Semiconductors | NXP Semiconductors TDF8555J/DBS37P//N2/TUBE NDP DSC BULK PACK |
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