TEM-105-02-03.0-H-D-WT Samtec
на замовлення 26 шт:
термін постачання 21-30 дні (днів)
| Кількість | Ціна |
|---|---|
| 2+ | 268.65 грн |
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Технічний опис TEM-105-02-03.0-H-D-WT Samtec
Description: CONN HEADER SMD 10POS 0.8MM, Features: Solder Retention, Packaging: Tray, Connector Type: Header, Current Rating (Amps): 2.9A per Contact, Mounting Type: Surface Mount, Number of Positions: 10, Number of Rows: 2, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.031" (0.80mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Gold, Contact Shape: Square, Insulation Height: 0.220" (5.60mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.063" (1.60mm).
Інші пропозиції TEM-105-02-03.0-H-D-WT за ціною від 344.92 грн до 452.82 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
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TEM-105-02-03.0-H-D-WT | Виробник : Samtec Inc. |
 Description: CONN HEADER SMD 10POS 0.8MMFeatures: Solder Retention Packaging: Tray Connector Type: Header Current Rating (Amps): 2.9A per Contact Mounting Type: Surface Mount Number of Positions: 10 Number of Rows: 2 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.031" (0.80mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Gold Contact Shape: Square Insulation Height: 0.220" (5.60mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.063" (1.60mm) |
на замовлення 223 шт: термін постачання 21-31 дні (днів) |
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