TFM-110-02-S-DH Samtec

Description: CONN HEADER SMD R/A 20POS 1.27MM, Packaging: Tube, Contact Length - Mating: 0.150" (3.81mm), Row Spacing - Mating: 0.050" (1.27mm), Insulation Material: Liquid Crystal Polymer (LCP), Shrouding: Shrouded - 4 Wall, Insulation Height: 0.225" (5.72mm), Contact Shape: Square, Part Status: Active, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Black, Contact Material: Phosphor Bronze, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Male Pin, Operating Temperature: -55°C ~ 125°C, Style: Board to Board or Cable, Number of Rows: 2, Number of Positions: 20, Mounting Type: Surface Mount, Right Angle, Current Rating (Amps): 3.2A per Contact, Voltage Rating: 275VAC, Connector Type: Header.