TFM-115-01-L-D-RE1-WT Samtec Inc.
Виробник: Samtec Inc.Description: CONN HEADER R/A 30POS 1.27MM
Packaging: Tube
Features: Solder Retention
Connector Type: Header, Elevated
Voltage Rating: 275VAC
Current Rating (Amps): 3.2A per Contact
Mounting Type: Through Hole, Right Angle
Number of Positions: 30
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 15.0µin (0.38µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.078" (1.98mm)
Insulation Height: 0.256" (6.50mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.050" (1.27mm)
Contact Length - Mating: 0.139" (3.53mm)
на замовлення 2440 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 323.89 грн |
| 25+ | 285.94 грн |
| 50+ | 261.80 грн |
| 100+ | 227.02 грн |
| 500+ | 208.91 грн |
| 1000+ | 201.82 грн |
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Технічний опис TFM-115-01-L-D-RE1-WT Samtec Inc.
Description: CONN HEADER R/A 30POS 1.27MM, Packaging: Tube, Features: Solder Retention, Connector Type: Header, Elevated, Voltage Rating: 275VAC, Current Rating (Amps): 3.2A per Contact, Mounting Type: Through Hole, Right Angle, Number of Positions: 30, Number of Rows: 2, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Contact Length - Post: 0.078" (1.98mm), Insulation Height: 0.256" (6.50mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.050" (1.27mm), Contact Length - Mating: 0.139" (3.53mm).
Інші пропозиції TFM-115-01-L-D-RE1-WT за ціною від 212.61 грн до 377.98 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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TFM-115-01-L-D-RE1-WT | Виробник : Samtec |
Headers & Wire Housings High-Reliability Tiger Eye Terminal Strips, .050" Pitch |
на замовлення 529 шт: термін постачання 21-30 дні (днів) |
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TFM-115-01-L-D-RE1-WT | Виробник : SAMTEC |
Description: SAMTEC - TFM-115-01-L-D-RE1-WT - Stiftleiste, Board-to-Board, Wire-to-Board, 1.27 mm, 2 Reihe(n), 30 Kontakt(e) tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 30Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board, Wire-to-Board Steckverbindertyp: PCB-Stiftleiste Produktpalette: Tiger Eye TFM productTraceability: No Kontaktanschluss: Durchsteckmontage, abgewinkelt Anzahl der Reihen: 2Reihe(n) Rastermaß: 1.27mm SVHC: No SVHC (21-Jan-2025) |
на замовлення 94 шт: термін постачання 21-31 дні (днів) |
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TFM-115-01-L-D-RE1-WT | Виробник : Samtec |
Conn Shrouded Header (4 Sides) HDR 30 POS 1.27mm Solder RA Side Entry Thru-Hole TIGER EYE™ Tube |
товару немає в наявності |