
TFM-115-02-L-D-P-TR Samtec
на замовлення 5200 шт:
термін постачання 21-31 дні (днів)
Кількість | Ціна |
---|---|
33+ | 372.45 грн |
500+ | 296.99 грн |
1000+ | 279.14 грн |
2500+ | 226.13 грн |
4800+ | 165.91 грн |
Відгуки про товар
Написати відгук
Технічний опис TFM-115-02-L-D-P-TR Samtec
Description: CONN HEADER SMD 30POS 1.27MM, Features: Pick and Place, Packaging: Tape & Reel (TR), Connector Type: Header, Voltage Rating: 275VAC, Current Rating (Amps): 2.9A per Contact, Mounting Type: Surface Mount, Number of Positions: 30, Number of Rows: 2, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.220" (5.60mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.050" (1.27mm), Contact Length - Mating: 0.131" (3.33mm).
Інші пропозиції TFM-115-02-L-D-P-TR за ціною від 345.83 грн до 662.14 грн
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна | ||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TFM-115-02-L-D-P-TR | Виробник : Samtec Inc. |
Description: CONN HEADER SMD 30POS 1.27MM Features: Pick and Place Packaging: Tape & Reel (TR) Connector Type: Header Voltage Rating: 275VAC Current Rating (Amps): 2.9A per Contact Mounting Type: Surface Mount Number of Positions: 30 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.220" (5.60mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.050" (1.27mm) Contact Length - Mating: 0.131" (3.33mm) |
на замовлення 5200 шт: термін постачання 21-31 дні (днів) |
|
||||||||||
|
TFM-115-02-L-D-P-TR | Виробник : Samtec Inc. |
Description: CONN HEADER SMD 30POS 1.27MM Features: Pick and Place Packaging: Cut Tape (CT) Connector Type: Header Voltage Rating: 275VAC Current Rating (Amps): 2.9A per Contact Mounting Type: Surface Mount Number of Positions: 30 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.220" (5.60mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.050" (1.27mm) Contact Length - Mating: 0.131" (3.33mm) |
на замовлення 5440 шт: термін постачання 21-31 дні (днів) |
|
||||||||||
![]() |
TFM-115-02-L-D-P-TR | Виробник : Samtec |
![]() |
товару немає в наявності |