TFM-115-12-S-D-A Samtec

Description: CONN HEADER SMD 30POS 1.27MM, Contact Length - Mating: 0.139" (3.53mm), Row Spacing - Mating: 0.050" (1.27mm), Insulation Material: Liquid Crystal Polymer (LCP), Shrouding: Shrouded - 4 Wall, Insulation Height: 0.290" (7.37mm), Contact Shape: Square, Part Status: Active, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Insulation Color: Black, Contact Material: Phosphor Bronze, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Male Pin, Operating Temperature: -55°C ~ 125°C, Style: Board to Board or Cable, Number of Rows: 2, Number of Positions: 30, Mounting Type: Surface Mount, Current Rating (Amps): 2.9A per Contact, Voltage Rating: 275VAC, Connector Type: Header, Features: Board Guide, Packaging: Tube.