TFM-130-01-L-D-RE2-WT Samtec
на замовлення 31 шт:
термін постачання 21-30 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 623.12 грн |
| 12+ | 577.00 грн |
| 60+ | 436.26 грн |
| 108+ | 402.42 грн |
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Технічний опис TFM-130-01-L-D-RE2-WT Samtec
Description: CONN HEADER R/A 60POS 1.27MM, Features: Solder Retention, Packaging: Tube, Connector Type: Header, Elevated, Voltage Rating: 275VAC, Current Rating (Amps): 2.9A per Contact, Mounting Type: Through Hole, Right Angle, Number of Positions: 60, Number of Rows: 2, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Contact Length - Post: 0.110" (2.79mm), Insulation Height: 0.256" (6.50mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.050" (1.27mm), Contact Length - Mating: 0.139" (3.53mm).
Інші пропозиції TFM-130-01-L-D-RE2-WT за ціною від 769.16 грн до 1308.31 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна | ||||||
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TFM-130-01-L-D-RE2-WT | Виробник : SAMTEC |
 Description: SAMTEC - TFM-130-01-L-D-RE2-WT - Stiftleiste, Board-to-Board, Wire-to-Board, 1.27 mm, 2 Reihe(n), 60 Kontakt(e)tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 60Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board, Wire-to-Board Steckverbindertyp: PCB Header Produktpalette: Tiger Eye TFM productTraceability: No Kontaktanschluss: Durchsteckmontage, abgewinkelt Anzahl der Reihen: 2Reihe(n) Rastermaß: 1.27mm SVHC: No SVHC (15-Jan-2018) |
на замовлення 18 шт: термін постачання 21-31 дні (днів) |
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TFM-130-01-L-D-RE2-WT | Виробник : Samtec Inc. |
Description: CONN HEADER R/A 60POS 1.27MM Features: Solder Retention Packaging: Tube Connector Type: Header, Elevated Voltage Rating: 275VAC Current Rating (Amps): 2.9A per Contact Mounting Type: Through Hole, Right Angle Number of Positions: 60 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Contact Length - Post: 0.110" (2.79mm) Insulation Height: 0.256" (6.50mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.050" (1.27mm) Contact Length - Mating: 0.139" (3.53mm) |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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