TSM-110-01-L-DV-P-TR Samtec Inc.
Виробник: Samtec Inc.Description: CONN HEADER SMD 20POS 2.54MM
Packaging: Tape & Reel (TR)
Features: Pick and Place
Connector Type: Header, Cuttable
Mounting Type: Surface Mount
Number of Positions: 20
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.230" (5.84mm)
на замовлення 3900 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 150+ | 157.65 грн |
| 300+ | 138.36 грн |
| 750+ | 117.86 грн |
| 1050+ | 93.17 грн |
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Технічний опис TSM-110-01-L-DV-P-TR Samtec Inc.
Description: CONN HEADER SMD 20POS 2.54MM, Packaging: Tape & Reel (TR), Features: Pick and Place, Connector Type: Header, Cuttable, Mounting Type: Surface Mount, Number of Positions: 20, Number of Rows: 2, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.100" (2.54mm), Shrouding: Unshrouded, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.100" (2.54mm), Contact Length - Mating: 0.230" (5.84mm).
Інші пропозиції TSM-110-01-L-DV-P-TR за ціною від 62.8 грн до 215.9 грн
| Фото | Назва | Виробник | Інформація |
Доступність |
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TSM-110-01-L-DV-P-TR | Виробник : Samtec Inc. |
Description: CONN HEADER SMD 20POS 2.54MM Packaging: Cut Tape (CT) Features: Pick and Place Connector Type: Header, Cuttable Mounting Type: Surface Mount Number of Positions: 20 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.230" (5.84mm) |
на замовлення 4194 шт: термін постачання 21-31 дні (днів) |
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TSM-110-01-L-DV-P-TR | Виробник : Samtec |
Headers & Wire Housings .100" Surface Mount Terminal Strip |
на замовлення 13660 шт: термін постачання 21-30 дні (днів) |
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TSM-110-01-L-DV-P-TR | Виробник : SAMTEC |
Description: SAMTEC - TSM-110-01-L-DV-P-TR - Stiftleiste, Board-to-Board, 2.54 mm, 2 Reihe(n), 20 Kontakt(e), Oberflächenmontage, TSM Series tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze usEccn: EAR99 Steckverbinderkragen: Ohne Kragen Anzahl der Kontakte: 20Contacts euEccn: NLR Steckverbindersysteme: Board-to-Board Produktpalette: TSM Series productTraceability: No Kontaktanschluss: Oberflächenmontage Anzahl der Reihen: 2Rows Rastermaß: 2.54mm SVHC: No SVHC (14-Jun-2023) |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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