TSM-113-01-L-DV-A-P-TR Samtec
на замовлення 24 шт:
термін постачання 21-30 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 457.75 грн |
| 10+ | 433.69 грн |
| 125+ | 313.89 грн |
| 500+ | 266.65 грн |
| 1000+ | 227.80 грн |
| 2500+ | 208.75 грн |
| 5000+ | 204.18 грн |
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Технічний опис TSM-113-01-L-DV-A-P-TR Samtec
Description: CONN HEADER SMD 26POS 2.54MM, Packaging: Tape & Reel (TR), Features: Board Guide, Pick and Place, Connector Type: Header, Cuttable, Mounting Type: Surface Mount, Number of Positions: 26, Number of Rows: 2, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.100" (2.54mm), Shrouding: Unshrouded, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.100" (2.54mm), Contact Length - Mating: 0.230" (5.84mm).
Інші пропозиції TSM-113-01-L-DV-A-P-TR
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
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TSM-113-01-L-DV-A-P-TR | Виробник : Samtec |
Conn Unshrouded Header HDR 26 POS 2.54mm Solder ST Top Entry SMD T/R |
товару немає в наявності |
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TSM-113-01-L-DV-A-P-TR | Виробник : Samtec Inc. |
Description: CONN HEADER SMD 26POS 2.54MMPackaging: Cut Tape (CT) Features: Board Guide, Pick and Place Connector Type: Header, Cuttable Mounting Type: Surface Mount Number of Positions: 26 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.230" (5.84mm) |
товару немає в наявності |
|
|
TSM-113-01-L-DV-A-P-TR | Виробник : Samtec Inc. |
Description: CONN HEADER SMD 26POS 2.54MMPackaging: Tape & Reel (TR) Features: Board Guide, Pick and Place Connector Type: Header, Cuttable Mounting Type: Surface Mount Number of Positions: 26 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.230" (5.84mm) |
товару немає в наявності |

