| Кількість | Ціна |
|---|---|
| 2+ | 230.24 грн |
| 51+ | 208.31 грн |
| 102+ | 160.70 грн |
| 510+ | 142.37 грн |
| 1003+ | 127.57 грн |
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Технічний опис TSM-113-01-L-DV Samtec
Description: CONN HEADER SMD 26POS 2.54MM, Packaging: Tube, Connector Type: Header, Cuttable, Mounting Type: Surface Mount, Number of Positions: 26, Number of Rows: 2, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 125°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.100" (2.54mm), Shrouding: Unshrouded, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.100" (2.54mm), Contact Length - Mating: 0.230" (5.84mm).
Інші пропозиції TSM-113-01-L-DV за ціною від 191.91 грн до 282.87 грн
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
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|---|---|---|---|---|---|---|---|---|---|---|---|
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TSM-113-01-L-DV | Samtec Inc. |
 Description: CONN HEADER SMD 26POS 2.54MMPackaging: Tube Connector Type: Header, Cuttable Mounting Type: Surface Mount Number of Positions: 26 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 125°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.230" (5.84mm) |
на замовлення 466 шт: термін постачання 21-31 дні (днів) |
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TSM-113-01-L-DV | SAMTEC |
Description: SAMTEC - TSM-113-01-L-DV - Stiftleiste, Board-to-Board, 2.54 mm, 2 Reihe(n), 26 Kontakt(e), Oberflächenmontage, TSM Series tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze isCanonical: Y usEccn: EAR99 Steckverbinderkragen: Ohne Kragen Anzahl der Kontakte: 26Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board Steckverbinder: Stiftleiste Produktpalette: TSM Series productTraceability: No Kontaktanschluss: Oberflächenmontage Anzahl der Reihen: 2Reihe(n) Rastermaß: 2.54mm SVHC: No SVHC (04-Feb-2026) |
на замовлення 15 шт: термін постачання 21-31 дні (днів) |
|
| TSM-113-01-L-DV |
|
Виробник: Samtec Inc.
Description: CONN HEADER SMD 26POS 2.54MM
Packaging: Tube
Connector Type: Header, Cuttable
Mounting Type: Surface Mount
Number of Positions: 26
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.230" (5.84mm)
Description: CONN HEADER SMD 26POS 2.54MM
Packaging: Tube
Connector Type: Header, Cuttable
Mounting Type: Surface Mount
Number of Positions: 26
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.230" (5.84mm)
на замовлення 466 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 2+ | 244.22 грн |
| 50+ | 216.94 грн |
| 100+ | 191.91 грн |
| TSM-113-01-L-DV |
|
Виробник: SAMTEC
Description: SAMTEC - TSM-113-01-L-DV - Stiftleiste, Board-to-Board, 2.54 mm, 2 Reihe(n), 26 Kontakt(e), Oberflächenmontage, TSM Series
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
usEccn: EAR99
Steckverbinderkragen: Ohne Kragen
Anzahl der Kontakte: 26Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Steckverbinder: Stiftleiste
Produktpalette: TSM Series
productTraceability: No
Kontaktanschluss: Oberflächenmontage
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 2.54mm
SVHC: No SVHC (04-Feb-2026)
Description: SAMTEC - TSM-113-01-L-DV - Stiftleiste, Board-to-Board, 2.54 mm, 2 Reihe(n), 26 Kontakt(e), Oberflächenmontage, TSM Series
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Vergoldete Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
isCanonical: Y
usEccn: EAR99
Steckverbinderkragen: Ohne Kragen
Anzahl der Kontakte: 26Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Steckverbinder: Stiftleiste
Produktpalette: TSM Series
productTraceability: No
Kontaktanschluss: Oberflächenmontage
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 2.54mm
SVHC: No SVHC (04-Feb-2026)
на замовлення 15 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 3+ | 282.87 грн |
| 10+ | 258.20 грн |