TW-15-08-S-D-566-118 Samtec Inc.
Виробник: Samtec Inc.
Description: CONN BRD STACK 2.00 30POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 30
Length - Overall Pin: 0.831" (21.107mm)
Length - Post (Mating): 0.147" (3.734mm)
Length - Stack Height: 0.566" (14.376mm)
Length - Tail: 0.118" (2.997mm)
Description: CONN BRD STACK 2.00 30POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 30
Length - Overall Pin: 0.831" (21.107mm)
Length - Post (Mating): 0.147" (3.734mm)
Length - Stack Height: 0.566" (14.376mm)
Length - Tail: 0.118" (2.997mm)
на замовлення 274 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 611.68 грн |
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Технічний опис TW-15-08-S-D-566-118 Samtec Inc.
Description: CONN BRD STACK 2.00 30POS, Packaging: Bulk, Color: Black, Mounting Type: Through Hole, Pitch: 0.079" (2.00mm), Row Spacing: 0.079" (2.00mm), Termination: Solder, Contact Finish - Post (Mating): Gold, Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm), Number of Rows: 2, Number of Positions: 30, Length - Overall Pin: 0.831" (21.107mm), Length - Post (Mating): 0.147" (3.734mm), Length - Stack Height: 0.566" (14.376mm), Length - Tail: 0.118" (2.997mm).
Інші пропозиції TW-15-08-S-D-566-118
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
TW-15-08-S-D-566-118 | Виробник : Samtec | Board to Board & Mezzanine Connectors Flexible Surface Mount Board Stacking Header, 2.00 mm Pitch |
товару немає в наявності |