Технічний опис UPD70F3529GMA9-GBK-G Renesas
Description: IC MCU 32BIT 2GB FLASH 176HLQFP, Packaging: Tray, Package / Case: 176-LQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 80MHz, Program Memory Size: 2GB (2G x 8), RAM Size: 96K x 8, Operating Temperature: -40°C ~ 105°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, EEPROM Size: 32K x 8, Core Processor: V850E2M, Data Converters: A/D 12x10b, 12x12b, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V, Connectivity: CANbus, CSI, I2C, LINbus, SPI, UART/USART, Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT, Supplier Device Package: 176-HLQFP (24x24), Grade: Automotive, Number of I/O: 127, DigiKey Programmable: Not Verified, Qualification: AEC-Q100.
Інші пропозиції UPD70F3529GMA9-GBK-G
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UPD70F3529GMA9-GBK-G | Виробник : Renesas Electronics Corporation |
Description: IC MCU 32BIT 2GB FLASH 176HLQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 2GB (2G x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 32K x 8 Core Processor: V850E2M Data Converters: A/D 12x10b, 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, CSI, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Supplier Device Package: 176-HLQFP (24x24) Grade: Automotive Number of I/O: 127 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
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UPD70F3529GMA9-GBK-G | Виробник : Renesas Electronics | 32-bit Microcontrollers - MCU MCU1 V850E2/DX4-H 70F3529-FLS T176_2424 |
товару немає в наявності |