WCI2012CPR18GDG INPAQ Technology Co., Ltd
Виробник: INPAQ Technology Co., LtdDescription: CHIP IND 2012,180NH,G,50Q,0.4A,3
Packaging: Cut Tape (CT)
Tolerance: ±2%
Package / Case: 0805 (2012 Metric)
Size / Dimension: 0.090" L x 0.068" W (2.29mm x 1.73mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Wirewound
Operating Temperature: -25°C ~ 125°C
DC Resistance (DCR): 640mOhm Max
Q @ Freq: 50 @ 250MHz
Frequency - Self Resonant: 870MHz
Material - Core: Ceramic
Inductance Frequency - Test: 100 MHz
Supplier Device Package: 0805
Height - Seated (Max): 0.060" (1.52mm)
Inductance: 180 nH
Current Rating (Amps): 400 mA
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Технічний опис WCI2012CPR18GDG INPAQ Technology Co., Ltd
Description: CHIP IND 2012,180NH,G,50Q,0.4A,3, Packaging: Cut Tape (CT), Tolerance: ±2%, Package / Case: 0805 (2012 Metric), Size / Dimension: 0.090" L x 0.068" W (2.29mm x 1.73mm), Mounting Type: Surface Mount, Shielding: Unshielded, Type: Wirewound, Operating Temperature: -25°C ~ 125°C, DC Resistance (DCR): 640mOhm Max, Q @ Freq: 50 @ 250MHz, Frequency - Self Resonant: 870MHz, Material - Core: Ceramic, Inductance Frequency - Test: 100 MHz, Supplier Device Package: 0805, Height - Seated (Max): 0.060" (1.52mm), Inductance: 180 nH, Current Rating (Amps): 400 mA.