WCI2012CPR68JDG INPAQ Technology Co., Ltd
Виробник: INPAQ Technology Co., LtdDescription: CHIP IND 2012,680NH,J,23Q,0.19A,
Packaging: Cut Tape (CT)
Tolerance: ±5%
Package / Case: 0805 (2012 Metric)
Size / Dimension: 0.090" L x 0.068" W (2.29mm x 1.73mm)
Mounting Type: Surface Mount
Shielding: Unshielded
Type: Wirewound
Operating Temperature: -25°C ~ 125°C
DC Resistance (DCR): 2.2Ohm Max
Q @ Freq: 23 @ 50MHz
Frequency - Self Resonant: 188MHz
Material - Core: Ceramic
Inductance Frequency - Test: 25 MHz
Supplier Device Package: 0805
Height - Seated (Max): 0.060" (1.52mm)
Inductance: 680 nH
Current Rating (Amps): 190 mA
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Технічний опис WCI2012CPR68JDG INPAQ Technology Co., Ltd
Description: CHIP IND 2012,680NH,J,23Q,0.19A,, Packaging: Cut Tape (CT), Tolerance: ±5%, Package / Case: 0805 (2012 Metric), Size / Dimension: 0.090" L x 0.068" W (2.29mm x 1.73mm), Mounting Type: Surface Mount, Shielding: Unshielded, Type: Wirewound, Operating Temperature: -25°C ~ 125°C, DC Resistance (DCR): 2.2Ohm Max, Q @ Freq: 23 @ 50MHz, Frequency - Self Resonant: 188MHz, Material - Core: Ceramic, Inductance Frequency - Test: 25 MHz, Supplier Device Package: 0805, Height - Seated (Max): 0.060" (1.52mm), Inductance: 680 nH, Current Rating (Amps): 190 mA.