XC228796F66LACKXUMA1 Infineon Technologies
Виробник: Infineon TechnologiesDescription: IC MCU 16/32B 768KB FLSH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 82K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: DMA, I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-144-4
Number of I/O: 118
DigiKey Programmable: Not Verified
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Технічний опис XC228796F66LACKXUMA1 Infineon Technologies
Description: IC MCU 16/32B 768KB FLSH 144LQFP, Packaging: Tape & Reel (TR), Package / Case: 144-LQFP Exposed Pad, Mounting Type: Surface Mount, Speed: 66MHz, Program Memory Size: 768KB (768K x 8), RAM Size: 82K x 8, Operating Temperature: -40°C ~ 125°C (TA), Oscillator Type: Internal, Program Memory Type: FLASH, Core Processor: C166SV2, Data Converters: A/D 24x10b, Core Size: 16/32-Bit, Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V, Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI, Peripherals: DMA, I2S, POR, PWM, WDT, Supplier Device Package: PG-LQFP-144-4, Number of I/O: 118, DigiKey Programmable: Not Verified.