Технічний опис XCV1000E-7FG860C XILINX
Description: IC FPGA 660 I/O 860FBGA, Packaging: Tray, Package / Case: 860-BGA Exposed Pad, Mounting Type: Surface Mount, Number of Gates: 1569178, Operating Temperature: 0°C ~ 85°C (TJ), Voltage - Supply: 1.71V ~ 1.89V, Number of Logic Elements/Cells: 27648, Supplier Device Package: 860-FBGA (42.5x42.5), Number of LABs/CLBs: 6144, Total RAM Bits: 393216, Number of I/O: 660, DigiKey Programmable: Not Verified.
Інші пропозиції XCV1000E-7FG860C
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
| XCV1000E-7FG860C | AMD |
Description: IC FPGA 660 I/O 860FBGAPackaging: Tray Package / Case: 860-BGA Exposed Pad Mounting Type: Surface Mount Number of Gates: 1569178 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.71V ~ 1.89V Number of Logic Elements/Cells: 27648 Supplier Device Package: 860-FBGA (42.5x42.5) Number of LABs/CLBs: 6144 Total RAM Bits: 393216 Number of I/O: 660 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. |
| XCV1000E-7FG860C |
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Виробник: AMD
Description: IC FPGA 660 I/O 860FBGA
Packaging: Tray
Package / Case: 860-BGA Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 1569178
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 27648
Supplier Device Package: 860-FBGA (42.5x42.5)
Number of LABs/CLBs: 6144
Total RAM Bits: 393216
Number of I/O: 660
DigiKey Programmable: Not Verified
Description: IC FPGA 660 I/O 860FBGA
Packaging: Tray
Package / Case: 860-BGA Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 1569178
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 27648
Supplier Device Package: 860-FBGA (42.5x42.5)
Number of LABs/CLBs: 6144
Total RAM Bits: 393216
Number of I/O: 660
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.


