Технічний опис XCZU19EG-L1FFVC1760I Xilinx
Description: IC SOC CORTEX-A53 1760FCBGA, Part Status: Active, Architecture: MCU, FPGA, Supplier Device Package: 1760-FCBGA (42.5x42.5), Peripherals: DMA, WDT, Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG, Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells, Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2, Operating Temperature: -40°C ~ 100°C (TJ), RAM Size: 256KB, Speed: 500MHz, 600MHz, 1.2GHz, Package / Case: 1760-BBGA, FCBGA, Packaging: Tray.
Інші пропозиції XCZU19EG-L1FFVC1760I
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ |
|---|---|---|---|---|---|
| XCZU19EG-L1FFVC1760I | AMD |
 Description: IC SOC CORTEX-A53 1760FCBGAPart Status: Active Architecture: MCU, FPGA Supplier Device Package: 1760-FCBGA (42.5x42.5) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 600MHz, 1.2GHz Package / Case: 1760-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |
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XCZU19EG-L1FFVC1760I | Xilinx |
SoC FPGA XCZU19EG-L1FFVC1760I |
товару немає в наявності |
В кошику од. на суму грн. |
| XCZU19EG-L1FFVC1760I |
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Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 1760FCBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU19EG-L1FFVC1760I |
|
Виробник: Xilinx
SoC FPGA XCZU19EG-L1FFVC1760I
SoC FPGA XCZU19EG-L1FFVC1760I
товару немає в наявності
В кошику
од. на суму грн.