XR2A-0811-N Omron Electronics Inc-EMC Div
Виробник: Omron Electronics Inc-EMC Div
Description: CONN IC DIP SOCKET 8POS GOLD
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
| Кількість | Ціна |
|---|---|
| 3+ | 114.72 грн |
| 10+ | 84.26 грн |
| 25+ | 75.79 грн |
| 60+ | 64.37 грн |
| 120+ | 59.58 грн |
| 300+ | 53.90 грн |
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Технічний опис XR2A-0811-N Omron Electronics Inc-EMC Div
Description: CONN IC DIP SOCKET 8POS GOLD, Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Part Status: Active, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 8 (2 x 4), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Bulk.
Інші пропозиції XR2A-0811-N
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
XR2A-0811-N | Виробник : Omron Electronics |
IC & Component Sockets Socket DIP Term 8P 7.62mm .25AuPlate |
на замовлення 940 шт: термін постачання 21-30 дні (днів) |