XR2C-0311-N Omron Electronics Inc-EMC Div
Виробник: Omron Electronics Inc-EMC Div
Description: CONN SOCKET SIP 3POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
| Кількість | Ціна |
|---|---|
| 10+ | 33.70 грн |
| 11+ | 28.08 грн |
| 25+ | 25.24 грн |
| 50+ | 23.23 грн |
| 100+ | 22.79 грн |
| 250+ | 20.92 грн |
| 500+ | 19.74 грн |
| 1000+ | 18.90 грн |
| 3000+ | 17.69 грн |
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Технічний опис XR2C-0311-N Omron Electronics Inc-EMC Div
Description: CONN SOCKET SIP 3POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: SIP, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 3 (1 x 3), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Інші пропозиції XR2C-0311-N за ціною від 18.39 грн до 40.07 грн
| Фото | Назва | Виробник | Інформація |
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XR2C-0311-N | Виробник : Omron Electronics |
IC & Component Sockets IC Socket |
на замовлення 76 шт: термін постачання 21-30 дні (днів) |
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