XR2C-1011-N Omron Electronics Inc-EMC Div
Виробник: Omron Electronics Inc-EMC Div
Description: CONN SOCKET SIP 10POS GOLD
Packaging: Bulk
Mounting Type: Threaded
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (1 x 10)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 126.31 грн |
| 10+ | 104.32 грн |
| 25+ | 96.92 грн |
| 50+ | 86.89 грн |
| 100+ | 82.84 грн |
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Технічний опис XR2C-1011-N Omron Electronics Inc-EMC Div
Description: CONN SOCKET SIP 10POS GOLD, Part Status: Active, Contact Material - Post: Brass, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 10 (1 x 10), Operating Temperature: -55°C ~ 125°C, Type: SIP, Mounting Type: Threaded, Packaging: Bulk.
Інші пропозиції XR2C-1011-N за ціною від 111.30 грн до 164.28 грн
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
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XR2C1011N | Omron Electronics Inc-EMC Div |
Description: CONN SOCKET SIP 10POS GOLD Part Status: Active Contact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 10 (1 x 10) Operating Temperature: -55°C ~ 125°C Type: SIP Mounting Type: Threaded Packaging: Bulk |
на замовлення 408 шт: термін постачання 21-31 дні (днів) |
|
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XR2C-1011-N | Omron Electronics |
IC & Component Sockets Connector |
на замовлення 400 шт: термін постачання 193-202 дні (днів) |
В кошику од. на суму грн. |
| XR2C1011N |
|
Виробник: Omron Electronics Inc-EMC Div
Description: CONN SOCKET SIP 10POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (1 x 10)
Operating Temperature: -55°C ~ 125°C
Type: SIP
Mounting Type: Threaded
Packaging: Bulk
Description: CONN SOCKET SIP 10POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 10 (1 x 10)
Operating Temperature: -55°C ~ 125°C
Type: SIP
Mounting Type: Threaded
Packaging: Bulk
на замовлення 408 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 164.28 грн |
| 10+ | 137.68 грн |
| 400+ | 111.30 грн |
| XR2C-1011-N |
|
Виробник: Omron Electronics
IC & Component Sockets Connector
IC & Component Sockets Connector
на замовлення 400 шт:
термін постачання 193-202 дні (днів)