XR2C-3200-HSG Omron Electronics Inc-EMC Div
Виробник: Omron Electronics Inc-EMC Div
Description: CONN IC SOCKET 32POS
Contact Material - Post: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Termination: Wire Wrap
Number of Positions or Pins (Grid): 32 (1 x 32)
Operating Temperature: -55°C ~ 125°C
Type: Housing
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
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Технічний опис XR2C-3200-HSG Omron Electronics Inc-EMC Div
Description: CONN IC SOCKET 32POS, Contact Material - Post: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Termination: Wire Wrap, Number of Positions or Pins (Grid): 32 (1 x 32), Operating Temperature: -55°C ~ 125°C, Type: Housing, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.
Інші пропозиції XR2C-3200-HSG
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
 |
XR2C-3200-HSG | Виробник : Omron Electronics |
IC & Component Sockets CONNECTOR |
товару немає в наявності |