XR2C-3205 Omron Electronics Inc-EMC Div


en-xr2.pdf
Виробник: Omron Electronics Inc-EMC Div
Description: CONN SOCKET SIP 32POS GOLD
Part Status: Active
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (1 x 32)
Operating Temperature: -55°C ~ 125°C
Type: SIP
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
на замовлення 95 шт:

термін постачання 21-31 дні (днів)
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1+391.63 грн
10+340.55 грн
25+318.06 грн
50+294.66 грн
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Технічний опис XR2C-3205 Omron Electronics Inc-EMC Div

Description: CONN SOCKET SIP 32POS GOLD, Part Status: Active, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 32 (1 x 32), Operating Temperature: -55°C ~ 125°C, Type: SIP, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.

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XR2C-3205 XR2C-3205 Виробник : Omron Electronics en_xr2-1290919.pdf IC & Component Sockets CONNECTOR
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