XR2C-3205 Omron Electronics Inc-EMC Div
Виробник: Omron Electronics Inc-EMC DivDescription: CONN SOCKET SIP 32POS GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (1 x 32)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
на замовлення 100 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 515.78 грн |
| 10+ | 448.81 грн |
| 25+ | 424.01 грн |
| 50+ | 388.2 грн |
| 100+ | 368.79 грн |
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Технічний опис XR2C-3205 Omron Electronics Inc-EMC Div
Description: CONN SOCKET SIP 32POS GOLD, Features: Closed Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: SIP, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 32 (1 x 32), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Beryllium Copper, Part Status: Active.
Інші пропозиції XR2C-3205
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
 |
XR2C-3205 | Виробник : Omron Electronics |
IC & Component Sockets CONNECTOR |
товар відсутній |