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ESQT-110-02-F-D-466 Samtec Inc. ESQT-110-02-F-D-466 Description: FLEXYZ FLEXIBLE-HEIGHT SOCKET ST
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 4.5A per Contact
Mounting Type: Through Hole
Number of Positions: 20
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.384" (9.75mm)
Insulation Height: 0.466" (11.84mm)
Row Spacing - Mating: 0.079" (2.00mm)
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
HDWM-11-59-G-D-466-SM-A-P Samtec Inc. Description: CONN HDR 22POS 0.05 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.050" (1.27mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 22
Length - Overall Pin: 0.931" (23.647mm)
Length - Post (Mating): 0.465" (11.811mm)
Length - Stack Height: 0.466" (11.836mm)
товару немає в наявності
В кошику  од. на суму  грн.
HDWM-15-59-G-D-466-SM-A-P Samtec Inc. Description: CONN HDR 30POS 0.05 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.050" (1.27mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 30
Length - Overall Pin: 0.931" (23.647mm)
Length - Post (Mating): 0.465" (11.811mm)
Length - Stack Height: 0.466" (11.836mm)
товару немає в наявності
В кошику  од. на суму  грн.
FW-43-05-G-D-466-160-A-TR Samtec Inc. fw_sm.pdf Description: CONN HDR 86POS 0.05 STACK SMD
Packaging: Tape & Reel (TR)
Color: Black
Mounting Type: Surface Mount
Pitch: 0.050" (1.27mm)
Row Spacing: 0.050" (1.27mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 86
Length - Overall Pin: 0.626" (15.900mm)
Length - Post (Mating): 0.160" (4.064mm)
Length - Stack Height: 0.466" (11.836mm)
товару немає в наявності
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ZLTMM-120-63-G-D-466 Samtec Inc. zltmm-1xx-xx-xx-d-xxx-xx-asm-mktg.pdf Description: 2.00 MM SHROUDED VARIABLE STACK
Features: Keying Slot
Packaging: Bulk
Connector Type: Header, Elevated
Mounting Type: Through Hole
Number of Positions: 40
Number of Rows: 2
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Post: Gold
Contact Shape: Square
Insulation Height: 0.466" (11.84mm)
Shrouding: Shrouded - 4 Wall
Overall Contact Length: 0.555" (14.10mm)
Insulation Material: Polyamide (PA), Nylon
Row Spacing - Mating: 0.079" (2.00mm)
Contact Length - Mating: 0.120" (3.05mm)
товару немає в наявності
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TW-20-07-S-D-466-SM-A-P Samtec Inc. TW-20-07-S-D-466-SM-A-P Description: FLEXIBLE SURFACE MOUNT BOARD STA
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 40
Length - Overall Pin: 0.751" (19.075mm)
Length - Post (Mating): 0.285" (7.239mm)
Length - Stack Height: 0.466" (11.836mm)
товару немає в наявності
В кошику  од. на суму  грн.
TW-28-07-S-D-466-SM-A-P Samtec Inc. TW-28-07-S-D-466-SM-A-P Description: FLEXIBLE SURFACE MOUNT BOARD STA
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 56
Length - Overall Pin: 0.751" (19.075mm)
Length - Post (Mating): 0.285" (7.239mm)
Length - Stack Height: 0.466" (11.836mm)
товару немає в наявності
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DW-05-10-TM-D-466 Samtec Inc. Description: FLEXIBLE BOARD STACKING HEADER W
товару немає в наявності
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DW-05-10-F-D-466 Samtec Inc. Description: FLEXIBLE BOARD STACKING HEADER W
товару немає в наявності
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DW-05-10-FM-D-466 Samtec Inc. Description: FLEXIBLE BOARD STACKING HEADER W
товару немає в наявності
В кошику  од. на суму  грн.
DW-08-09-F-D-466 Samtec Inc. Description: FLEXIBLE BOARD STACKING HEADER W
товару немає в наявності
В кошику  од. на суму  грн.
DW-05-10-G-D-466 Samtec Inc. Description: FLEXIBLE BOARD STACKING HEADER W
товару немає в наявності
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DW-05-11-L-D-466 Samtec Inc. Description: FLEXIBLE BOARD STACKING HEADER W
товару немає в наявності
В кошику  од. на суму  грн.
DW-05-10-LM-D-466 Samtec Inc. Description: FLEXIBLE BOARD STACKING HEADER W
товару немає в наявності
В кошику  од. на суму  грн.
DW-18-09-S-D-466 Samtec Inc. Description: FLEXIBLE BOARD STACKING HEADER W
товару немає в наявності
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DW-14-11-F-D-466 Samtec Inc. Description: FLEXIBLE BOARD STACKING HEADER W
товару немає в наявності
В кошику  од. на суму  грн.
TW-06-06-T-D-446-140 Samtec Inc. tw-xx-xx-x-x-xxx-xxx-xxx-xx-mkt1.pdf Description: CONN BRD STACK 2.00 12POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Tin
Number of Rows: 2
Number of Positions: 12
Length - Overall Pin: 0.673" (17.094mm)
Length - Post (Mating): 0.087" (2.210mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.140" (3.556mm)
на замовлення 243 шт:
термін постачання 21-31 дні (днів)
3+132.92 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
TW-06-06-T-D-446-140 Samtec Inc. tw-xx-xx-x-x-xxx-xxx-xxx-xx-mkt1.pdf Description: CONN BRD STACK 2.00 12POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Tin
Number of Rows: 2
Number of Positions: 12
Length - Overall Pin: 0.673" (17.094mm)
Length - Post (Mating): 0.087" (2.210mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.140" (3.556mm)
на замовлення 403 шт:
термін постачання 21-31 дні (днів)
2+241.30 грн
50+180.32 грн
100+145.74 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
ZW-10-09-G-D-446-158 Samtec Inc. zw_th.pdf Description: CONN BRD STACK .100" 20POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 20
Length - Overall Pin: 0.730" (18.542mm)
Length - Post (Mating): 0.126" (3.200mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.158" (4.013mm)
на замовлення 738 шт:
термін постачання 21-31 дні (днів)
2+251.59 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
ZW-10-09-G-D-446-158 Samtec Inc. zw_th.pdf Description: CONN BRD STACK .100" 20POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 20
Length - Overall Pin: 0.730" (18.542mm)
Length - Post (Mating): 0.126" (3.200mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.158" (4.013mm)
на замовлення 1225 шт:
термін постачання 21-31 дні (днів)
1+458.08 грн
50+359.40 грн
100+305.06 грн
500+254.99 грн
1000+198.20 грн
В кошику  од. на суму  грн.
ZW-14-09-G-D-446-158 Samtec Inc. zw_th.pdf Description: CONN BRD STACK .100" 28POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 28
Length - Overall Pin: 0.730" (18.542mm)
Length - Post (Mating): 0.126" (3.200mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.158" (4.013mm)
на замовлення 442 шт:
термін постачання 21-31 дні (днів)
2+271.37 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
ZW-14-09-G-D-446-158 Samtec Inc. zw_th.pdf Description: CONN BRD STACK .100" 28POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 28
Length - Overall Pin: 0.730" (18.542mm)
Length - Post (Mating): 0.126" (3.200mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.158" (4.013mm)
на замовлення 734 шт:
термін постачання 21-31 дні (днів)
1+493.69 грн
25+429.78 грн
50+398.93 грн
100+356.99 грн
500+278.17 грн
В кошику  од. на суму  грн.
HW-05-15-G-D-446-SM-A Samtec Inc. hw_th.pdf Description: CONN HDR 10POS 0.1 STACK SMD
Packaging: Bulk
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 10
Length - Overall Pin: 0.565" (14.351mm)
Length - Post (Mating): 0.119" (3.023mm)
Length - Stack Height: 0.446" (11.328mm)
на замовлення 274 шт:
термін постачання 21-31 дні (днів)
1+355.23 грн
50+279.12 грн
100+237.13 грн
В кошику  од. на суму  грн.
HW-05-15-G-D-446-SM-A Samtec Inc. hw_th.pdf Description: CONN HDR 10POS 0.1 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 10
Length - Overall Pin: 0.565" (14.351mm)
Length - Post (Mating): 0.119" (3.023mm)
Length - Stack Height: 0.446" (11.328mm)
на замовлення 165 шт:
термін постачання 21-31 дні (днів)
43+195.40 грн
Мінімальне замовлення: 43
В кошику  од. на суму  грн.
ZW-15-10-S-D-446-150 Samtec Inc. zw_th.pdf Description: CONN BRD STACK .100" 30POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 30
Length - Overall Pin: 0.830" (21.082mm)
Length - Post (Mating): 0.234" (5.944mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.150" (3.810mm)
на замовлення 442 шт:
термін постачання 21-31 дні (днів)
1+394.79 грн
В кошику  од. на суму  грн.
TW-25-06-S-D-446-090 Samtec Inc. tw_th.pdf Description: CONN BRD STACK 2.00 50POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 50
Length - Overall Pin: 0.673" (17.094mm)
Length - Post (Mating): 0.137" (3.480mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.090" (2.286mm)
на замовлення 182 шт:
термін постачання 21-31 дні (днів)
1+894.81 грн
В кошику  од. на суму  грн.
TW-25-06-S-D-446-090 Samtec Inc. tw_th.pdf Description: CONN BRD STACK 2.00 50POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 50
Length - Overall Pin: 0.673" (17.094mm)
Length - Post (Mating): 0.137" (3.480mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.090" (2.286mm)
на замовлення 302 шт:
термін постачання 21-31 дні (днів)
1+1625.84 грн
10+1483.27 грн
25+1427.70 грн
50+1307.39 грн
100+974.76 грн
В кошику  од. на суму  грн.
HW-07-15-G-D-446-SM-A Samtec Inc. hw_th.pdf Description: CONN HDR 14POS 0.1 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 14
Length - Overall Pin: 0.565" (14.351mm)
Length - Post (Mating): 0.119" (3.023mm)
Length - Stack Height: 0.446" (11.328mm)
на замовлення 135 шт:
термін постачання 21-31 дні (днів)
32+258.17 грн
Мінімальне замовлення: 32
В кошику  од. на суму  грн.
HW-07-15-G-D-446-SM-A Samtec Inc. hw_th.pdf Description: CONN HDR 14POS 0.1 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 14
Length - Overall Pin: 0.565" (14.351mm)
Length - Post (Mating): 0.119" (3.023mm)
Length - Stack Height: 0.446" (11.328mm)
на замовлення 224 шт:
термін постачання 21-31 дні (днів)
1+469.16 грн
50+369.27 грн
100+313.70 грн
В кошику  од. на суму  грн.
HW-13-09-G-D-446-SM Samtec Inc. hw_th.pdf Description: CONN HDR 26POS 0.1 STACK SMD
Packaging: Bulk
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 26
Length - Overall Pin: 0.665" (16.891mm)
Length - Post (Mating): 0.219" (5.563mm)
Length - Stack Height: 0.446" (11.328mm)
на замовлення 166 шт:
термін постачання 21-31 дні (днів)
1+597.33 грн
25+519.95 грн
50+484.13 грн
100+432.32 грн
В кошику  од. на суму  грн.
MTMM-128-11-G-D-446 Samtec Inc. mtmm_th.pdf Description: 2MM TERMINAL STRIP
Packaging: Bulk
на замовлення 90 шт:
термін постачання 21-31 дні (днів)
1+767.43 грн
В кошику  од. на суму  грн.
MTMM-128-11-G-D-446 Samtec Inc. mtmm_th.pdf Description: 2MM TERMINAL STRIP
Packaging: Bulk
на замовлення 149 шт:
термін постачання 21-31 дні (днів)
1+1395.61 грн
10+1242.44 грн
25+1174.51 грн
50+1061.68 грн
100+783.51 грн
В кошику  од. на суму  грн.
HW-36-09-G-D-446-SM Samtec Inc. hw_th.pdf Description: CONN HDR 72POS 0.1 STACK SMD
Packaging: Bulk
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 72
Length - Overall Pin: 0.665" (16.891mm)
Length - Post (Mating): 0.219" (5.563mm)
Length - Stack Height: 0.446" (11.328mm)
на замовлення 73 шт:
термін постачання 21-31 дні (днів)
1+1572.04 грн
10+1399.31 грн
25+1322.74 грн
50+1197.29 грн
В кошику  од. на суму  грн.
HW-36-09-G-D-446-SM Samtec Inc. hw_th.pdf Description: CONN HDR 72POS 0.1 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 72
Length - Overall Pin: 0.665" (16.891mm)
Length - Post (Mating): 0.219" (5.563mm)
Length - Stack Height: 0.446" (11.328mm)
на замовлення 44 шт:
термін постачання 21-31 дні (днів)
6+864.87 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
HSEC8-110-01-S-DV-A-WT-TR Samtec Inc. HSEC8-110-01-S-DV-A-WT-TR Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
HSEC8-113-01-SM-DV-A-L2-K-TR Samtec Inc. HSEC8-113-01-SM-DV-A-L2-K-TR Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 26
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 13
Number of Rows: 2
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В кошику  од. на суму  грн.
HSEC8-110-03-S-DV-A-WT-TR Samtec Inc. HSEC8-110-03-S-DV-A-WT-TR Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
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HSEC8-109-01-S-DV-A-L2-K Samtec Inc. HSEC8-109-01-S-DV-A-L2-K Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Latches
Packaging: Bulk
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 18
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 9
Number of Rows: 2
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В кошику  од. на суму  грн.
HSEC8-110-01-SM-DV-K-TR Samtec Inc. HSEC8-110-01-SM-DV-K-TR Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
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В кошику  од. на суму  грн.
HSEC8-170-03-L-DV-A-TR Samtec Inc. HSEC8-170-03-L-DV-A-TR Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 140
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30; 40
Number of Rows: 2
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HSEC8-130-03-L-DV-A-WT-K-TR Samtec Inc. HSEC8-130-03-L-DV-A-WT-K-TR Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
HSEC8-110-01-S-DV-A-GR-K-TR Samtec Inc. HSEC8-110-01-S-DV-A-GR-K-TR Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
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HSEC8-120-01-2-DP-A-K Samtec Inc. HSEC8-120-01-2-DP-A-K Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 40
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Material: Copper Alloy
Number of Rows: 2
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В кошику  од. на суму  грн.
HSEC8-110-01-H-DV-A-WT-K-TR Samtec Inc. HSEC8-110-01-H-DV-A-WT-K-TR Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place, Solder Retention
Packaging: Bulk
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
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В кошику  од. на суму  грн.
HSEC8-137-01-L-DV-K-TR Samtec Inc. HSEC8-DV_Series.pdf Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 74
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 15; 20
Number of Rows: 2
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В кошику  од. на суму  грн.
HSEC8-109-01-S-DV-A-BL-TR Samtec Inc. HSEC8-109-01-S-DV-A-BL-TR Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Board Lock
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 18
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 4; 5
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
HSEC8-120-03-S-DV-A-WT-K-TR Samtec Inc. HSEC8-120-03-S-DV-A-WT-K-TR Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 40
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 20
Number of Rows: 2
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В кошику  од. на суму  грн.
HSEC8-140-01-L-DV-A-GR-K-TR Samtec Inc. HSEC8-140-01-L-DV-A-GR-K-TR Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 80
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 18; 22
Number of Rows: 2
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В кошику  од. на суму  грн.
HSEC8-140-03-S-DV-A-TR Samtec Inc. HSEC8-140-03-S-DV-A-TR Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 80
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 18; 22
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
HSEC8-120-01-SM-DV-A-WT Samtec Inc. HSEC8-120-01-SM-DV-A-WT Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Solder Retention
Packaging: Tray
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 40
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 20
Number of Rows: 2
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HSEC8-113-01-H-DV-A-BL-TR Samtec Inc. HSEC8-113-01-H-DV-A-BL-TR Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Board Lock
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 26
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 6; 7
Number of Rows: 2
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В кошику  од. на суму  грн.
HSEC8-112-01-L-DP-A-WT-K Samtec Inc. HSEC8-112-01-L-DP-A-WT-K Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 24
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Copper Alloy
Number of Rows: 2
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В кошику  од. на суму  грн.
HSEC8-109-01-L-RA-BL-TR Samtec Inc. HSEC8-109-01-L-RA-BL-TR Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Lock
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount, Right Angle
Number of Positions: 18
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 4; 5
Number of Rows: 2
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В кошику  од. на суму  грн.
HSEC8-116-01-L-DP-A-WT-K Samtec Inc. HSEC8-116-01-L-DP-A-WT-K Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 32
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Copper Alloy
Number of Rows: 2
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В кошику  од. на суму  грн.
HSEC8-160-01-L-DV-TR Samtec Inc. HSEC8-160-01-L-DV-TR Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 120
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 28; 32
Number of Rows: 2
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HSEC8-130-03-H-DV-A Samtec Inc. HSEC8-130-03-H-DV-A Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide
Packaging: Tray
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30
Number of Rows: 2
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HSEC8-130-01-SM-DV-A-BL-K-TR Samtec Inc. HSEC8-130-01-SM-DV-A-BL-K-TR Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Board Lock, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30
Number of Rows: 2
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В кошику  од. на суму  грн.
HSEC8-170-01-S-DV-A-WT-TR Samtec Inc. HSEC8-170-01-S-DV-A-WT-TR Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 140
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30; 40
Number of Rows: 2
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HSEC8-109-01-S-RA-BL-TR Samtec Inc. HSEC8-109-01-S-RA-BL-TR Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Number of Rows: 2
Number of Positions/Bay/Row: 4; 5
Contact Material: Beryllium Copper
Contact Finish Thickness: 30.0µin (0.76µm)
Termination: Solder
Card Thickness: 0.062" (1.57mm)
Card Type: PCI Express™
Contact Type: Cantilever
Read Out: Dual
Operating Temperature: -55°C ~ 125°C
Pitch: 0.031" (0.80mm)
Number of Positions: 18
Mounting Type: Surface Mount, Right Angle
Color: Black
Contact Finish: Gold
Gender: Female
Features: Board Lock
Packaging: Tape & Reel (TR)
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HSEC8-130-01-S-DV-A-GR-K-TR Samtec Inc. HSEC8-130-01-S-DV-A-GR-K-TR Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30
Number of Rows: 2
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ESQT-110-02-F-D-466 ESQT-110-02-F-D-466
Виробник: Samtec Inc.
Description: FLEXYZ FLEXIBLE-HEIGHT SOCKET ST
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 4.5A per Contact
Mounting Type: Through Hole
Number of Positions: 20
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 125°C
Contact Type: Forked
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.00µin (0.076µm)
Contact Finish - Post: Tin
Contact Length - Post: 0.384" (9.75mm)
Insulation Height: 0.466" (11.84mm)
Row Spacing - Mating: 0.079" (2.00mm)
Number of Rows: 2
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В кошику  од. на суму  грн.
HDWM-11-59-G-D-466-SM-A-P
Виробник: Samtec Inc.
Description: CONN HDR 22POS 0.05 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.050" (1.27mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 22
Length - Overall Pin: 0.931" (23.647mm)
Length - Post (Mating): 0.465" (11.811mm)
Length - Stack Height: 0.466" (11.836mm)
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HDWM-15-59-G-D-466-SM-A-P
Виробник: Samtec Inc.
Description: CONN HDR 30POS 0.05 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.050" (1.27mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 30
Length - Overall Pin: 0.931" (23.647mm)
Length - Post (Mating): 0.465" (11.811mm)
Length - Stack Height: 0.466" (11.836mm)
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FW-43-05-G-D-466-160-A-TR fw_sm.pdf
Виробник: Samtec Inc.
Description: CONN HDR 86POS 0.05 STACK SMD
Packaging: Tape & Reel (TR)
Color: Black
Mounting Type: Surface Mount
Pitch: 0.050" (1.27mm)
Row Spacing: 0.050" (1.27mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 86
Length - Overall Pin: 0.626" (15.900mm)
Length - Post (Mating): 0.160" (4.064mm)
Length - Stack Height: 0.466" (11.836mm)
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ZLTMM-120-63-G-D-466 zltmm-1xx-xx-xx-d-xxx-xx-asm-mktg.pdf
Виробник: Samtec Inc.
Description: 2.00 MM SHROUDED VARIABLE STACK
Features: Keying Slot
Packaging: Bulk
Connector Type: Header, Elevated
Mounting Type: Through Hole
Number of Positions: 40
Number of Rows: 2
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Phosphor Bronze
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 20.0µin (0.51µm)
Contact Finish - Post: Gold
Contact Shape: Square
Insulation Height: 0.466" (11.84mm)
Shrouding: Shrouded - 4 Wall
Overall Contact Length: 0.555" (14.10mm)
Insulation Material: Polyamide (PA), Nylon
Row Spacing - Mating: 0.079" (2.00mm)
Contact Length - Mating: 0.120" (3.05mm)
товару немає в наявності
В кошику  од. на суму  грн.
TW-20-07-S-D-466-SM-A-P TW-20-07-S-D-466-SM-A-P
Виробник: Samtec Inc.
Description: FLEXIBLE SURFACE MOUNT BOARD STA
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 40
Length - Overall Pin: 0.751" (19.075mm)
Length - Post (Mating): 0.285" (7.239mm)
Length - Stack Height: 0.466" (11.836mm)
товару немає в наявності
В кошику  од. на суму  грн.
TW-28-07-S-D-466-SM-A-P TW-28-07-S-D-466-SM-A-P
Виробник: Samtec Inc.
Description: FLEXIBLE SURFACE MOUNT BOARD STA
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 56
Length - Overall Pin: 0.751" (19.075mm)
Length - Post (Mating): 0.285" (7.239mm)
Length - Stack Height: 0.466" (11.836mm)
товару немає в наявності
В кошику  од. на суму  грн.
DW-05-10-TM-D-466
Виробник: Samtec Inc.
Description: FLEXIBLE BOARD STACKING HEADER W
товару немає в наявності
В кошику  од. на суму  грн.
DW-05-10-F-D-466
Виробник: Samtec Inc.
Description: FLEXIBLE BOARD STACKING HEADER W
товару немає в наявності
В кошику  од. на суму  грн.
DW-05-10-FM-D-466
Виробник: Samtec Inc.
Description: FLEXIBLE BOARD STACKING HEADER W
товару немає в наявності
В кошику  од. на суму  грн.
DW-08-09-F-D-466
Виробник: Samtec Inc.
Description: FLEXIBLE BOARD STACKING HEADER W
товару немає в наявності
В кошику  од. на суму  грн.
DW-05-10-G-D-466
Виробник: Samtec Inc.
Description: FLEXIBLE BOARD STACKING HEADER W
товару немає в наявності
В кошику  од. на суму  грн.
DW-05-11-L-D-466
Виробник: Samtec Inc.
Description: FLEXIBLE BOARD STACKING HEADER W
товару немає в наявності
В кошику  од. на суму  грн.
DW-05-10-LM-D-466
Виробник: Samtec Inc.
Description: FLEXIBLE BOARD STACKING HEADER W
товару немає в наявності
В кошику  од. на суму  грн.
DW-18-09-S-D-466
Виробник: Samtec Inc.
Description: FLEXIBLE BOARD STACKING HEADER W
товару немає в наявності
В кошику  од. на суму  грн.
DW-14-11-F-D-466
Виробник: Samtec Inc.
Description: FLEXIBLE BOARD STACKING HEADER W
товару немає в наявності
В кошику  од. на суму  грн.
TW-06-06-T-D-446-140 tw-xx-xx-x-x-xxx-xxx-xxx-xx-mkt1.pdf
Виробник: Samtec Inc.
Description: CONN BRD STACK 2.00 12POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Tin
Number of Rows: 2
Number of Positions: 12
Length - Overall Pin: 0.673" (17.094mm)
Length - Post (Mating): 0.087" (2.210mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.140" (3.556mm)
на замовлення 243 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+132.92 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
TW-06-06-T-D-446-140 tw-xx-xx-x-x-xxx-xxx-xxx-xx-mkt1.pdf
Виробник: Samtec Inc.
Description: CONN BRD STACK 2.00 12POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Tin
Number of Rows: 2
Number of Positions: 12
Length - Overall Pin: 0.673" (17.094mm)
Length - Post (Mating): 0.087" (2.210mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.140" (3.556mm)
на замовлення 403 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+241.30 грн
50+180.32 грн
100+145.74 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
ZW-10-09-G-D-446-158 zw_th.pdf
Виробник: Samtec Inc.
Description: CONN BRD STACK .100" 20POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 20
Length - Overall Pin: 0.730" (18.542mm)
Length - Post (Mating): 0.126" (3.200mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.158" (4.013mm)
на замовлення 738 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+251.59 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
ZW-10-09-G-D-446-158 zw_th.pdf
Виробник: Samtec Inc.
Description: CONN BRD STACK .100" 20POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 20
Length - Overall Pin: 0.730" (18.542mm)
Length - Post (Mating): 0.126" (3.200mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.158" (4.013mm)
на замовлення 1225 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+458.08 грн
50+359.40 грн
100+305.06 грн
500+254.99 грн
1000+198.20 грн
В кошику  од. на суму  грн.
ZW-14-09-G-D-446-158 zw_th.pdf
Виробник: Samtec Inc.
Description: CONN BRD STACK .100" 28POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 28
Length - Overall Pin: 0.730" (18.542mm)
Length - Post (Mating): 0.126" (3.200mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.158" (4.013mm)
на замовлення 442 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+271.37 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
ZW-14-09-G-D-446-158 zw_th.pdf
Виробник: Samtec Inc.
Description: CONN BRD STACK .100" 28POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 28
Length - Overall Pin: 0.730" (18.542mm)
Length - Post (Mating): 0.126" (3.200mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.158" (4.013mm)
на замовлення 734 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+493.69 грн
25+429.78 грн
50+398.93 грн
100+356.99 грн
500+278.17 грн
В кошику  од. на суму  грн.
HW-05-15-G-D-446-SM-A hw_th.pdf
Виробник: Samtec Inc.
Description: CONN HDR 10POS 0.1 STACK SMD
Packaging: Bulk
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 10
Length - Overall Pin: 0.565" (14.351mm)
Length - Post (Mating): 0.119" (3.023mm)
Length - Stack Height: 0.446" (11.328mm)
на замовлення 274 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+355.23 грн
50+279.12 грн
100+237.13 грн
В кошику  од. на суму  грн.
HW-05-15-G-D-446-SM-A hw_th.pdf
Виробник: Samtec Inc.
Description: CONN HDR 10POS 0.1 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 10
Length - Overall Pin: 0.565" (14.351mm)
Length - Post (Mating): 0.119" (3.023mm)
Length - Stack Height: 0.446" (11.328mm)
на замовлення 165 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
43+195.40 грн
Мінімальне замовлення: 43
В кошику  од. на суму  грн.
ZW-15-10-S-D-446-150 zw_th.pdf
Виробник: Samtec Inc.
Description: CONN BRD STACK .100" 30POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 30
Length - Overall Pin: 0.830" (21.082mm)
Length - Post (Mating): 0.234" (5.944mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.150" (3.810mm)
на замовлення 442 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+394.79 грн
В кошику  од. на суму  грн.
TW-25-06-S-D-446-090 tw_th.pdf
Виробник: Samtec Inc.
Description: CONN BRD STACK 2.00 50POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 50
Length - Overall Pin: 0.673" (17.094mm)
Length - Post (Mating): 0.137" (3.480mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.090" (2.286mm)
на замовлення 182 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+894.81 грн
В кошику  од. на суму  грн.
TW-25-06-S-D-446-090 tw_th.pdf
Виробник: Samtec Inc.
Description: CONN BRD STACK 2.00 50POS
Packaging: Bulk
Color: Black
Mounting Type: Through Hole
Pitch: 0.079" (2.00mm)
Row Spacing: 0.079" (2.00mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 50
Length - Overall Pin: 0.673" (17.094mm)
Length - Post (Mating): 0.137" (3.480mm)
Length - Stack Height: 0.446" (11.328mm)
Length - Tail: 0.090" (2.286mm)
на замовлення 302 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1625.84 грн
10+1483.27 грн
25+1427.70 грн
50+1307.39 грн
100+974.76 грн
В кошику  од. на суму  грн.
HW-07-15-G-D-446-SM-A hw_th.pdf
Виробник: Samtec Inc.
Description: CONN HDR 14POS 0.1 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 14
Length - Overall Pin: 0.565" (14.351mm)
Length - Post (Mating): 0.119" (3.023mm)
Length - Stack Height: 0.446" (11.328mm)
на замовлення 135 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
32+258.17 грн
Мінімальне замовлення: 32
В кошику  од. на суму  грн.
HW-07-15-G-D-446-SM-A hw_th.pdf
Виробник: Samtec Inc.
Description: CONN HDR 14POS 0.1 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 14
Length - Overall Pin: 0.565" (14.351mm)
Length - Post (Mating): 0.119" (3.023mm)
Length - Stack Height: 0.446" (11.328mm)
на замовлення 224 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+469.16 грн
50+369.27 грн
100+313.70 грн
В кошику  од. на суму  грн.
HW-13-09-G-D-446-SM hw_th.pdf
Виробник: Samtec Inc.
Description: CONN HDR 26POS 0.1 STACK SMD
Packaging: Bulk
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 26
Length - Overall Pin: 0.665" (16.891mm)
Length - Post (Mating): 0.219" (5.563mm)
Length - Stack Height: 0.446" (11.328mm)
на замовлення 166 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+597.33 грн
25+519.95 грн
50+484.13 грн
100+432.32 грн
В кошику  од. на суму  грн.
MTMM-128-11-G-D-446 mtmm_th.pdf
Виробник: Samtec Inc.
Description: 2MM TERMINAL STRIP
Packaging: Bulk
на замовлення 90 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+767.43 грн
В кошику  од. на суму  грн.
MTMM-128-11-G-D-446 mtmm_th.pdf
Виробник: Samtec Inc.
Description: 2MM TERMINAL STRIP
Packaging: Bulk
на замовлення 149 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1395.61 грн
10+1242.44 грн
25+1174.51 грн
50+1061.68 грн
100+783.51 грн
В кошику  од. на суму  грн.
HW-36-09-G-D-446-SM hw_th.pdf
Виробник: Samtec Inc.
Description: CONN HDR 72POS 0.1 STACK SMD
Packaging: Bulk
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 72
Length - Overall Pin: 0.665" (16.891mm)
Length - Post (Mating): 0.219" (5.563mm)
Length - Stack Height: 0.446" (11.328mm)
на замовлення 73 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1572.04 грн
10+1399.31 грн
25+1322.74 грн
50+1197.29 грн
В кошику  од. на суму  грн.
HW-36-09-G-D-446-SM hw_th.pdf
Виробник: Samtec Inc.
Description: CONN HDR 72POS 0.1 STACK SMD
Packaging: Tube
Color: Black
Mounting Type: Surface Mount
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold
Contact Finish Thickness - Post (Mating): 10.0µin (0.25µm)
Number of Rows: 2
Number of Positions: 72
Length - Overall Pin: 0.665" (16.891mm)
Length - Post (Mating): 0.219" (5.563mm)
Length - Stack Height: 0.446" (11.328mm)
на замовлення 44 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+864.87 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
HSEC8-110-01-S-DV-A-WT-TR HSEC8-110-01-S-DV-A-WT-TR
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
HSEC8-113-01-SM-DV-A-L2-K-TR HSEC8-113-01-SM-DV-A-L2-K-TR
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 26
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 13
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
HSEC8-110-03-S-DV-A-WT-TR HSEC8-110-03-S-DV-A-WT-TR
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
HSEC8-109-01-S-DV-A-L2-K HSEC8-109-01-S-DV-A-L2-K
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Latches
Packaging: Bulk
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 18
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 9
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
HSEC8-110-01-SM-DV-K-TR HSEC8-110-01-SM-DV-K-TR
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
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HSEC8-170-03-L-DV-A-TR HSEC8-170-03-L-DV-A-TR
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 140
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30; 40
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
HSEC8-130-03-L-DV-A-WT-K-TR HSEC8-130-03-L-DV-A-WT-K-TR
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30
Number of Rows: 2
товару немає в наявності
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HSEC8-110-01-S-DV-A-GR-K-TR HSEC8-110-01-S-DV-A-GR-K-TR
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
HSEC8-120-01-2-DP-A-K HSEC8-120-01-2-DP-A-K
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 40
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Material: Copper Alloy
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
HSEC8-110-01-H-DV-A-WT-K-TR HSEC8-110-01-H-DV-A-WT-K-TR
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place, Solder Retention
Packaging: Bulk
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 10
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
HSEC8-137-01-L-DV-K-TR HSEC8-DV_Series.pdf
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 74
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 15; 20
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
HSEC8-109-01-S-DV-A-BL-TR HSEC8-109-01-S-DV-A-BL-TR
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Board Lock
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 18
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 4; 5
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
HSEC8-120-03-S-DV-A-WT-K-TR HSEC8-120-03-S-DV-A-WT-K-TR
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 40
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 20
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
HSEC8-140-01-L-DV-A-GR-K-TR HSEC8-140-01-L-DV-A-GR-K-TR
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 80
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 18; 22
Number of Rows: 2
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В кошику  од. на суму  грн.
HSEC8-140-03-S-DV-A-TR HSEC8-140-03-S-DV-A-TR
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 80
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 18; 22
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
HSEC8-120-01-SM-DV-A-WT HSEC8-120-01-SM-DV-A-WT
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Solder Retention
Packaging: Tray
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 40
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 20
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
HSEC8-113-01-H-DV-A-BL-TR HSEC8-113-01-H-DV-A-BL-TR
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Board Lock
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 26
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 6; 7
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
HSEC8-112-01-L-DP-A-WT-K HSEC8-112-01-L-DP-A-WT-K
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 24
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Copper Alloy
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
HSEC8-109-01-L-RA-BL-TR HSEC8-109-01-L-RA-BL-TR
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Lock
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount, Right Angle
Number of Positions: 18
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 4; 5
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
HSEC8-116-01-L-DP-A-WT-K HSEC8-116-01-L-DP-A-WT-K
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 32
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Copper Alloy
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
HSEC8-160-01-L-DV-TR HSEC8-160-01-L-DV-TR
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 120
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 28; 32
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
HSEC8-130-03-H-DV-A HSEC8-130-03-H-DV-A
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide
Packaging: Tray
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.093" (2.36mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
HSEC8-130-01-SM-DV-A-BL-K-TR HSEC8-130-01-SM-DV-A-BL-K-TR
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Board Lock, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
HSEC8-170-01-S-DV-A-WT-TR HSEC8-170-01-S-DV-A-WT-TR
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 140
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30; 40
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
HSEC8-109-01-S-RA-BL-TR HSEC8-109-01-S-RA-BL-TR
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Number of Rows: 2
Number of Positions/Bay/Row: 4; 5
Contact Material: Beryllium Copper
Contact Finish Thickness: 30.0µin (0.76µm)
Termination: Solder
Card Thickness: 0.062" (1.57mm)
Card Type: PCI Express™
Contact Type: Cantilever
Read Out: Dual
Operating Temperature: -55°C ~ 125°C
Pitch: 0.031" (0.80mm)
Number of Positions: 18
Mounting Type: Surface Mount, Right Angle
Color: Black
Contact Finish: Gold
Gender: Female
Features: Board Lock
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику  од. на суму  грн.
HSEC8-130-01-S-DV-A-GR-K-TR HSEC8-130-01-S-DV-A-GR-K-TR
Виробник: Samtec Inc.
Description: 0.80 MM HIGH-SPEED POWER/SIGNAL
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
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