Результат пошуку "G288" : > 120
Вид перегляду :
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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XGG2-88-S21Z1 Код товару: 166015 |
Різні комплектуючі > Різні комплектуючі 3 |
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XGG2-88-Z1 (SAIA-BURGESS) Код товару: 198775 |
Пасивні компоненти > Кнопки та клавіатури |
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XGG2-88-Z1 перемикач Код товару: 197624 |
Пасивні компоненти > Перемикачі, тумблери |
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Мікроперемикач XGG2-88-J27Z1 (кінцівка) Код товару: 94049 |
Burgess |
Пасивні компоненти > Перемикачі, тумблери Група: Мікроперемикачі Монтаж: Клеми з отвором Опис Опис: SPDT Кількість положень: 2 Навантажувальна здатність: 10 A / 250 VAC |
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G288 | DMC Tools | Measuring Tools GAGE GO .1755 NO-GO .1805 |
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A2F060M3E-1CSG288 | Microsemi Corporation |
Description: IC SOC CORTEX-M3 100MHZ 288CSP Packaging: Tray Package / Case: 288-TFBGA, CSPBGA Speed: 100MHz RAM Size: 16KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Connectivity: EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, POR, WDT Supplier Device Package: 288-CSP (11x11) Architecture: MCU, FPGA Flash Size: 128KB |
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A2F060M3E-1CSG288I | Microsemi Corporation |
Description: IC SOC CORTEX-M3 100MHZ 288CSP Packaging: Tray Package / Case: 288-TFBGA, CSPBGA Speed: 100MHz RAM Size: 16KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Connectivity: EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, POR, WDT Supplier Device Package: 288-CSP (11x11) Architecture: MCU, FPGA Flash Size: 128KB |
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A2F060M3E-CSG288 | Microsemi Corporation |
Description: IC SOC CORTEX-M3 80MHZ 288CSP Packaging: Tray Package / Case: 288-TFBGA, CSPBGA Speed: 80MHz RAM Size: 16KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Connectivity: EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, POR, WDT Supplier Device Package: 288-CSP (11x11) Architecture: MCU, FPGA Flash Size: 128KB |
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A2F060M3E-CSG288I | Microsemi Corporation |
Description: IC SOC CORTEX-M3 80MHZ 288CSP Packaging: Tray Package / Case: 288-TFBGA, CSPBGA Speed: 80MHz RAM Size: 16KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops Connectivity: EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, POR, WDT Supplier Device Package: 288-CSP (11x11) Architecture: MCU, FPGA Flash Size: 128KB |
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A2F200M3F-1CSG288 | MICROCHIP (MICROSEMI) |
Category: Programmable circuits Description: IC: FPGA; SMD; CS288; Number of macrocells: 4608; I/O: 135; 100MHz Type of integrated circuit: FPGA Mounting: SMD Supply voltage: 1.425...1.575V DC Case: CS288 Number of inputs/outputs: 135 Number of macrocells: 4608 Number of gates: 200k Frequency: 100MHz Memory: 64kB SRAM; 256kB FLASH |
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A2F200M3F-1CSG288 | Microchip Technology |
Description: IC SOC CORTEX-M3 100MHZ 288CSP Packaging: Tray Package / Case: 288-TFBGA, CSPBGA Speed: 100MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, POR, WDT Supplier Device Package: 288-CSP (11x11) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
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A2F200M3F-1CSG288 | Microchip Technology | FPGA SmartFusion Family 200K Gates 100MHz 130nm Technology 1.5V 288-Pin CSP |
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A2F200M3F-1CSG288 | Microchip Technology | SoC FPGA SmartFusion FPGA, 2KLEs |
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A2F200M3F-1CSG288I | Microchip Technology | FPGA SmartFusion Family 200K Gates 100MHz 130nm Technology 1.5V 288-Pin CSP |
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A2F200M3F-1CSG288I | Microchip Technology |
Description: IC SOC CORTEX-M3 100MHZ 288CSP Packaging: Tray Package / Case: 288-TFBGA, CSPBGA Speed: 100MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, POR, WDT Supplier Device Package: 288-CSP (11x11) Architecture: MCU, FPGA Flash Size: 256KB Part Status: Active |
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A2F200M3F-CSG288 | Microchip Technology |
Description: IC SOC CORTEX-M3 80MHZ 288CSP Packaging: Tray Package / Case: 288-TFBGA, CSPBGA Speed: 80MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, POR, WDT Supplier Device Package: 288-CSP (11x11) Architecture: MCU, FPGA Flash Size: 256KB |
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A2F200M3F-CSG288 | Microchip Technology | FPGA SmartFusion Family 200K Gates 100MHz 130nm Technology 1.5V 288-Pin CSP |
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A2F200M3F-CSG288I | Microchip Technology | FPGA SmartFusion Family 200K Gates 100MHz 130nm Technology 1.5V 288-Pin CSP |
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A2F200M3F-CSG288I | Microchip Technology |
Description: IC SOC CORTEX-M3 80MHZ 288CSP Packaging: Tray Package / Case: 288-TFBGA, CSPBGA Speed: 80MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, POR, WDT Supplier Device Package: 288-CSP (11x11) Architecture: MCU, FPGA Flash Size: 256KB |
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A2F500M3G-1CSG288 | MICROCHIP (MICROSEMI) |
Category: Programmable circuits Description: IC: FPGA; SMD; CS288; Number of macrocells: 11.52k; I/O: 135; 100MHz Type of integrated circuit: FPGA Mounting: SMD Supply voltage: 1.425...1.575V DC Case: CS288 Number of inputs/outputs: 135 Number of macrocells: 11.52k Number of gates: 500k Frequency: 100MHz Memory: 64kB SRAM; 256kB FLASH |
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A2F500M3G-1CSG288 | Microchip Technology |
Description: IC SOC CORTEX-M3 100MHZ 288CSP Packaging: Tray Package / Case: 288-TFBGA, CSPBGA Speed: 100MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, POR, WDT Supplier Device Package: 288-CSP (11x11) Architecture: MCU, FPGA Flash Size: 512KB |
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A2F500M3G-1CSG288 | Microchip Technology | SoC FPGA SmartFusion FPGA, 6KLEs |
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A2F500M3G-1CSG288I | Microchip Technology |
Description: IC SOC CORTEX-M3 100MHZ 288CSP Packaging: Tray Package / Case: 288-TFBGA, CSPBGA Speed: 100MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, POR, WDT Supplier Device Package: 288-CSP (11x11) Architecture: MCU, FPGA Flash Size: 512KB |
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A2F500M3G-1CSG288I | Microchip Technology | FPGA SmartFusion Family 500K Gates 100MHz 130nm Technology 1.5V 288-Pin CSP |
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A2F500M3G-1CSG288IQ091 | Microchip Technology | FPGA SmartFusion Family 500K Gates 100MHz 130nm Technology 1.5V 288-Pin CSP |
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A2F500M3G-1CSG288IZ091 | Microchip Technology | A2F500M3G-1CSG288IZ091 |
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A2F500M3G-1CSG288IZ265 | Microchip Technology | A2F500M3G-1CSG288IZ265 |
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A2F500M3G-CSG288 | Microchip Technology |
Description: IC SOC CORTEX-M3 80MHZ 288CSP Packaging: Tray Package / Case: 288-TFBGA, CSPBGA Speed: 80MHz RAM Size: 64KB Operating Temperature: 0°C ~ 85°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, POR, WDT Supplier Device Package: 288-CSP (11x11) Architecture: MCU, FPGA Flash Size: 512KB |
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A2F500M3G-CSG288 | Microchip Technology | FPGA SmartFusion Family 500K Gates 100MHz 130nm Technology 1.5V 288-Pin CSP |
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A2F500M3G-CSG288I | Microchip Technology | FPGA SmartFusion Family 500K Gates 100MHz 130nm Technology 1.5V 288-Pin CSP |
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A2F500M3G-CSG288I | Microchip Technology |
Description: IC SOC CORTEX-M3 80MHZ 288CSP Packaging: Tray Package / Case: 288-TFBGA, CSPBGA Speed: 80MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: ARM® Cortex®-M3 Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, POR, WDT Supplier Device Package: 288-CSP (11x11) Architecture: MCU, FPGA Flash Size: 512KB |
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ACA3106G28-84SB | Amphenol Industrial | Circular MIL Spec Connector 9C 9#8 SKT Plug |
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CG2884H1A-DWB | Prysmian Group |
Description: CBL FIBER OPTIC 125UM Packaging: Spool Jacket (Insulation) Material: Polyethylene (PE) Tensile Strength: 90.7kg Style: Standard Type: Multimode Jacket Color: Black Core Diameter: 62.5µm Cladding Diameter: 125µm |
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CG2884H1F-DWB | Prysmian Group |
Description: CBL FIBER OPTIC 125UM Packaging: Spool Jacket (Insulation) Material: Polyethylene (PE) Tensile Strength: 81.6kg Style: Standard Type: Multimode Jacket (Insulation) Diameter: 0.940" (23.88mm) Jacket Color: Black Core Diameter: 62.5µm Cladding Diameter: 125µm |
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CG2884M1A-DWB | Prysmian Group |
Description: CBL FIBER OPTIC 125UM Packaging: Spool Jacket (Insulation) Material: Polyethylene (PE) Tensile Strength: 81.6kg Style: Standard Type: Multimode Jacket (Insulation) Diameter: 0.790" (20.07mm) Jacket Color: Black Core Diameter: 62.5µm Cladding Diameter: 125µm |
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CG2884M1F-DWB | Prysmian Group |
Description: CBL FIBER OPTIC 125UM Packaging: Spool Jacket (Insulation) Material: Polyethylene (PE) Tensile Strength: 81.6kg Style: Standard Type: Multimode Jacket (Insulation) Diameter: 0.850" (21.59mm) Jacket Color: Black Core Diameter: 62.5µm Cladding Diameter: 125µm |
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GTC030G28-84S(025) | Amphenol Industrial Operations |
Description: CONN RCPT Packaging: Bulk |
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GTC030G28-84S-025 | Amphenol Industrial | Circular MIL Spec Connector GT 9C 9#8 SKT RECP |
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GTC06G-28-8P | Amphenol Industrial Operations |
Description: PLUG Packaging: Bulk |
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GTC06G-28-8P | Amphenol Industrial | Circular MIL Spec Connector PLUG |
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GTC06G-28-8P(125) | Amphenol Industrial | Circular MIL Spec Connector PLUG |
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GTC06G-28-8P(125) | Amphenol Industrial Operations |
Description: PLUG Packaging: Bulk |
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GTC06G-28-8S | Amphenol Industrial | Circular MIL Spec Connector PLUG |
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GTC06G-28-8S | Amphenol Industrial Operations |
Description: PLUG Packaging: Bulk |
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GTC06G-28-8S(125) | Amphenol Industrial Operations |
Description: PLUG Packaging: Bulk |
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GTC06G-28-8S(125) | Amphenol Industrial | Circular MIL Spec Connector Straight Plug Crimp |
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GTC06G28-84S-025 | Amphenol Industrial | Circular MIL Spec Connector GT 9C 9#8 SKT PLUG |
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GTS06G-28-8P | Amphenol Industrial Operations |
Description: PLUG Packaging: Bulk |
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GTS06G-28-8S | Amphenol Industrial Operations |
Description: PLUG Packaging: Bulk |
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MTJG-2-88AR11-FSM-PG-LH-C5 | Adam Technologies | GANGED MODULAR JACK 1*2PORT 8P8C RA 30GOLD BK SHLD REAR PCB GND PANEL GND LED=GRN&YEL CAT5 RoHS |
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MTJG-2-88AR21-FSM-PG-L16 | Adam Technologies | CONNECTOR, MODULAR JACK, GANGED |
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MTJG-2-88AR21-FSW-PG | Adam Technologies | CONNECTOR, MODULAR JACK, GANGED |
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MTJG-2-88AR21-FSW-PG | Adam Tech | Modular Connectors / Ethernet Connectors CONNECTOR, MODULAR JACK, GANGED |
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MTJG-2-88ARX1 | Adam Technologies | GANGED MODULAR JACK 1*2PORT 8P8C RA SG RoHS |
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MTJG-2-88ARX1-FSM-PG-LG | Adam Technologies | MODULAR TELEPHONE JACK GANGED 8P8C |
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MTJG-2-88ARX1-FSM-PG-LG | Adam Tech | Modular Connectors / Ethernet Connectors CONNECTOR, MODULAR JACK, GANGED |
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XGG2-88-Z1 (SAIA-BURGESS) Код товару: 198775 |
товар відсутній
Мікроперемикач XGG2-88-J27Z1 (кінцівка) Код товару: 94049 |
Виробник: Burgess
Пасивні компоненти > Перемикачі, тумблери
Група: Мікроперемикачі
Монтаж: Клеми з отвором
Опис Опис: SPDT
Кількість положень: 2
Навантажувальна здатність: 10 A / 250 VAC
Пасивні компоненти > Перемикачі, тумблери
Група: Мікроперемикачі
Монтаж: Клеми з отвором
Опис Опис: SPDT
Кількість положень: 2
Навантажувальна здатність: 10 A / 250 VAC
товар відсутній
A2F060M3E-1CSG288 |
Виробник: Microsemi Corporation
Description: IC SOC CORTEX-M3 100MHZ 288CSP
Packaging: Tray
Package / Case: 288-TFBGA, CSPBGA
Speed: 100MHz
RAM Size: 16KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 288-CSP (11x11)
Architecture: MCU, FPGA
Flash Size: 128KB
Description: IC SOC CORTEX-M3 100MHZ 288CSP
Packaging: Tray
Package / Case: 288-TFBGA, CSPBGA
Speed: 100MHz
RAM Size: 16KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 288-CSP (11x11)
Architecture: MCU, FPGA
Flash Size: 128KB
товар відсутній
A2F060M3E-1CSG288I |
Виробник: Microsemi Corporation
Description: IC SOC CORTEX-M3 100MHZ 288CSP
Packaging: Tray
Package / Case: 288-TFBGA, CSPBGA
Speed: 100MHz
RAM Size: 16KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 288-CSP (11x11)
Architecture: MCU, FPGA
Flash Size: 128KB
Description: IC SOC CORTEX-M3 100MHZ 288CSP
Packaging: Tray
Package / Case: 288-TFBGA, CSPBGA
Speed: 100MHz
RAM Size: 16KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 288-CSP (11x11)
Architecture: MCU, FPGA
Flash Size: 128KB
товар відсутній
A2F060M3E-CSG288 |
Виробник: Microsemi Corporation
Description: IC SOC CORTEX-M3 80MHZ 288CSP
Packaging: Tray
Package / Case: 288-TFBGA, CSPBGA
Speed: 80MHz
RAM Size: 16KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 288-CSP (11x11)
Architecture: MCU, FPGA
Flash Size: 128KB
Description: IC SOC CORTEX-M3 80MHZ 288CSP
Packaging: Tray
Package / Case: 288-TFBGA, CSPBGA
Speed: 80MHz
RAM Size: 16KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 288-CSP (11x11)
Architecture: MCU, FPGA
Flash Size: 128KB
товар відсутній
A2F060M3E-CSG288I |
Виробник: Microsemi Corporation
Description: IC SOC CORTEX-M3 80MHZ 288CSP
Packaging: Tray
Package / Case: 288-TFBGA, CSPBGA
Speed: 80MHz
RAM Size: 16KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 288-CSP (11x11)
Architecture: MCU, FPGA
Flash Size: 128KB
Description: IC SOC CORTEX-M3 80MHZ 288CSP
Packaging: Tray
Package / Case: 288-TFBGA, CSPBGA
Speed: 80MHz
RAM Size: 16KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Connectivity: EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 288-CSP (11x11)
Architecture: MCU, FPGA
Flash Size: 128KB
товар відсутній
A2F200M3F-1CSG288 |
Виробник: MICROCHIP (MICROSEMI)
Category: Programmable circuits
Description: IC: FPGA; SMD; CS288; Number of macrocells: 4608; I/O: 135; 100MHz
Type of integrated circuit: FPGA
Mounting: SMD
Supply voltage: 1.425...1.575V DC
Case: CS288
Number of inputs/outputs: 135
Number of macrocells: 4608
Number of gates: 200k
Frequency: 100MHz
Memory: 64kB SRAM; 256kB FLASH
Category: Programmable circuits
Description: IC: FPGA; SMD; CS288; Number of macrocells: 4608; I/O: 135; 100MHz
Type of integrated circuit: FPGA
Mounting: SMD
Supply voltage: 1.425...1.575V DC
Case: CS288
Number of inputs/outputs: 135
Number of macrocells: 4608
Number of gates: 200k
Frequency: 100MHz
Memory: 64kB SRAM; 256kB FLASH
товар відсутній
A2F200M3F-1CSG288 |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 100MHZ 288CSP
Packaging: Tray
Package / Case: 288-TFBGA, CSPBGA
Speed: 100MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 288-CSP (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 100MHZ 288CSP
Packaging: Tray
Package / Case: 288-TFBGA, CSPBGA
Speed: 100MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 288-CSP (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
товар відсутній
A2F200M3F-1CSG288 |
Виробник: Microchip Technology
FPGA SmartFusion Family 200K Gates 100MHz 130nm Technology 1.5V 288-Pin CSP
FPGA SmartFusion Family 200K Gates 100MHz 130nm Technology 1.5V 288-Pin CSP
товар відсутній
A2F200M3F-1CSG288I |
Виробник: Microchip Technology
FPGA SmartFusion Family 200K Gates 100MHz 130nm Technology 1.5V 288-Pin CSP
FPGA SmartFusion Family 200K Gates 100MHz 130nm Technology 1.5V 288-Pin CSP
товар відсутній
A2F200M3F-1CSG288I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 100MHZ 288CSP
Packaging: Tray
Package / Case: 288-TFBGA, CSPBGA
Speed: 100MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 288-CSP (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
Description: IC SOC CORTEX-M3 100MHZ 288CSP
Packaging: Tray
Package / Case: 288-TFBGA, CSPBGA
Speed: 100MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 288-CSP (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Part Status: Active
товар відсутній
A2F200M3F-CSG288 |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 80MHZ 288CSP
Packaging: Tray
Package / Case: 288-TFBGA, CSPBGA
Speed: 80MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 288-CSP (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 80MHZ 288CSP
Packaging: Tray
Package / Case: 288-TFBGA, CSPBGA
Speed: 80MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 288-CSP (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
товар відсутній
A2F200M3F-CSG288 |
Виробник: Microchip Technology
FPGA SmartFusion Family 200K Gates 100MHz 130nm Technology 1.5V 288-Pin CSP
FPGA SmartFusion Family 200K Gates 100MHz 130nm Technology 1.5V 288-Pin CSP
товар відсутній
A2F200M3F-CSG288I |
Виробник: Microchip Technology
FPGA SmartFusion Family 200K Gates 100MHz 130nm Technology 1.5V 288-Pin CSP
FPGA SmartFusion Family 200K Gates 100MHz 130nm Technology 1.5V 288-Pin CSP
товар відсутній
A2F200M3F-CSG288I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 80MHZ 288CSP
Packaging: Tray
Package / Case: 288-TFBGA, CSPBGA
Speed: 80MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 288-CSP (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
Description: IC SOC CORTEX-M3 80MHZ 288CSP
Packaging: Tray
Package / Case: 288-TFBGA, CSPBGA
Speed: 80MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 288-CSP (11x11)
Architecture: MCU, FPGA
Flash Size: 256KB
товар відсутній
A2F500M3G-1CSG288 |
Виробник: MICROCHIP (MICROSEMI)
Category: Programmable circuits
Description: IC: FPGA; SMD; CS288; Number of macrocells: 11.52k; I/O: 135; 100MHz
Type of integrated circuit: FPGA
Mounting: SMD
Supply voltage: 1.425...1.575V DC
Case: CS288
Number of inputs/outputs: 135
Number of macrocells: 11.52k
Number of gates: 500k
Frequency: 100MHz
Memory: 64kB SRAM; 256kB FLASH
Category: Programmable circuits
Description: IC: FPGA; SMD; CS288; Number of macrocells: 11.52k; I/O: 135; 100MHz
Type of integrated circuit: FPGA
Mounting: SMD
Supply voltage: 1.425...1.575V DC
Case: CS288
Number of inputs/outputs: 135
Number of macrocells: 11.52k
Number of gates: 500k
Frequency: 100MHz
Memory: 64kB SRAM; 256kB FLASH
товар відсутній
A2F500M3G-1CSG288 |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 100MHZ 288CSP
Packaging: Tray
Package / Case: 288-TFBGA, CSPBGA
Speed: 100MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 288-CSP (11x11)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 100MHZ 288CSP
Packaging: Tray
Package / Case: 288-TFBGA, CSPBGA
Speed: 100MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 288-CSP (11x11)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
A2F500M3G-1CSG288I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 100MHZ 288CSP
Packaging: Tray
Package / Case: 288-TFBGA, CSPBGA
Speed: 100MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 288-CSP (11x11)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 100MHZ 288CSP
Packaging: Tray
Package / Case: 288-TFBGA, CSPBGA
Speed: 100MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 288-CSP (11x11)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
A2F500M3G-1CSG288I |
Виробник: Microchip Technology
FPGA SmartFusion Family 500K Gates 100MHz 130nm Technology 1.5V 288-Pin CSP
FPGA SmartFusion Family 500K Gates 100MHz 130nm Technology 1.5V 288-Pin CSP
товар відсутній
A2F500M3G-1CSG288IQ091 |
Виробник: Microchip Technology
FPGA SmartFusion Family 500K Gates 100MHz 130nm Technology 1.5V 288-Pin CSP
FPGA SmartFusion Family 500K Gates 100MHz 130nm Technology 1.5V 288-Pin CSP
товар відсутній
A2F500M3G-CSG288 |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 80MHZ 288CSP
Packaging: Tray
Package / Case: 288-TFBGA, CSPBGA
Speed: 80MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 288-CSP (11x11)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 80MHZ 288CSP
Packaging: Tray
Package / Case: 288-TFBGA, CSPBGA
Speed: 80MHz
RAM Size: 64KB
Operating Temperature: 0°C ~ 85°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 288-CSP (11x11)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
A2F500M3G-CSG288 |
Виробник: Microchip Technology
FPGA SmartFusion Family 500K Gates 100MHz 130nm Technology 1.5V 288-Pin CSP
FPGA SmartFusion Family 500K Gates 100MHz 130nm Technology 1.5V 288-Pin CSP
товар відсутній
A2F500M3G-CSG288I |
Виробник: Microchip Technology
FPGA SmartFusion Family 500K Gates 100MHz 130nm Technology 1.5V 288-Pin CSP
FPGA SmartFusion Family 500K Gates 100MHz 130nm Technology 1.5V 288-Pin CSP
товар відсутній
A2F500M3G-CSG288I |
Виробник: Microchip Technology
Description: IC SOC CORTEX-M3 80MHZ 288CSP
Packaging: Tray
Package / Case: 288-TFBGA, CSPBGA
Speed: 80MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 288-CSP (11x11)
Architecture: MCU, FPGA
Flash Size: 512KB
Description: IC SOC CORTEX-M3 80MHZ 288CSP
Packaging: Tray
Package / Case: 288-TFBGA, CSPBGA
Speed: 80MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: ARM® Cortex®-M3
Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 288-CSP (11x11)
Architecture: MCU, FPGA
Flash Size: 512KB
товар відсутній
ACA3106G28-84SB |
Виробник: Amphenol Industrial
Circular MIL Spec Connector 9C 9#8 SKT Plug
Circular MIL Spec Connector 9C 9#8 SKT Plug
товар відсутній
CG2884H1A-DWB |
Виробник: Prysmian Group
Description: CBL FIBER OPTIC 125UM
Packaging: Spool
Jacket (Insulation) Material: Polyethylene (PE)
Tensile Strength: 90.7kg
Style: Standard
Type: Multimode
Jacket Color: Black
Core Diameter: 62.5µm
Cladding Diameter: 125µm
Description: CBL FIBER OPTIC 125UM
Packaging: Spool
Jacket (Insulation) Material: Polyethylene (PE)
Tensile Strength: 90.7kg
Style: Standard
Type: Multimode
Jacket Color: Black
Core Diameter: 62.5µm
Cladding Diameter: 125µm
товар відсутній
CG2884H1F-DWB |
Виробник: Prysmian Group
Description: CBL FIBER OPTIC 125UM
Packaging: Spool
Jacket (Insulation) Material: Polyethylene (PE)
Tensile Strength: 81.6kg
Style: Standard
Type: Multimode
Jacket (Insulation) Diameter: 0.940" (23.88mm)
Jacket Color: Black
Core Diameter: 62.5µm
Cladding Diameter: 125µm
Description: CBL FIBER OPTIC 125UM
Packaging: Spool
Jacket (Insulation) Material: Polyethylene (PE)
Tensile Strength: 81.6kg
Style: Standard
Type: Multimode
Jacket (Insulation) Diameter: 0.940" (23.88mm)
Jacket Color: Black
Core Diameter: 62.5µm
Cladding Diameter: 125µm
товар відсутній
CG2884M1A-DWB |
Виробник: Prysmian Group
Description: CBL FIBER OPTIC 125UM
Packaging: Spool
Jacket (Insulation) Material: Polyethylene (PE)
Tensile Strength: 81.6kg
Style: Standard
Type: Multimode
Jacket (Insulation) Diameter: 0.790" (20.07mm)
Jacket Color: Black
Core Diameter: 62.5µm
Cladding Diameter: 125µm
Description: CBL FIBER OPTIC 125UM
Packaging: Spool
Jacket (Insulation) Material: Polyethylene (PE)
Tensile Strength: 81.6kg
Style: Standard
Type: Multimode
Jacket (Insulation) Diameter: 0.790" (20.07mm)
Jacket Color: Black
Core Diameter: 62.5µm
Cladding Diameter: 125µm
товар відсутній
CG2884M1F-DWB |
Виробник: Prysmian Group
Description: CBL FIBER OPTIC 125UM
Packaging: Spool
Jacket (Insulation) Material: Polyethylene (PE)
Tensile Strength: 81.6kg
Style: Standard
Type: Multimode
Jacket (Insulation) Diameter: 0.850" (21.59mm)
Jacket Color: Black
Core Diameter: 62.5µm
Cladding Diameter: 125µm
Description: CBL FIBER OPTIC 125UM
Packaging: Spool
Jacket (Insulation) Material: Polyethylene (PE)
Tensile Strength: 81.6kg
Style: Standard
Type: Multimode
Jacket (Insulation) Diameter: 0.850" (21.59mm)
Jacket Color: Black
Core Diameter: 62.5µm
Cladding Diameter: 125µm
товар відсутній
GTC030G28-84S(025) |
товар відсутній
GTC030G28-84S-025 |
Виробник: Amphenol Industrial
Circular MIL Spec Connector GT 9C 9#8 SKT RECP
Circular MIL Spec Connector GT 9C 9#8 SKT RECP
товар відсутній
GTC06G-28-8P |
товар відсутній
GTC06G-28-8P(125) |
товар відсутній
GTC06G-28-8S |
товар відсутній
GTC06G-28-8S(125) |
товар відсутній
GTC06G-28-8S(125) |
Виробник: Amphenol Industrial
Circular MIL Spec Connector Straight Plug Crimp
Circular MIL Spec Connector Straight Plug Crimp
товар відсутній
GTC06G28-84S-025 |
Виробник: Amphenol Industrial
Circular MIL Spec Connector GT 9C 9#8 SKT PLUG
Circular MIL Spec Connector GT 9C 9#8 SKT PLUG
товар відсутній
GTS06G-28-8P |
товар відсутній
GTS06G-28-8S |
товар відсутній
MTJG-2-88AR11-FSM-PG-LH-C5 |
Виробник: Adam Technologies
GANGED MODULAR JACK 1*2PORT 8P8C RA 30GOLD BK SHLD REAR PCB GND PANEL GND LED=GRN&YEL CAT5 RoHS
GANGED MODULAR JACK 1*2PORT 8P8C RA 30GOLD BK SHLD REAR PCB GND PANEL GND LED=GRN&YEL CAT5 RoHS
товар відсутній
MTJG-2-88AR21-FSW-PG |
Виробник: Adam Tech
Modular Connectors / Ethernet Connectors CONNECTOR, MODULAR JACK, GANGED
Modular Connectors / Ethernet Connectors CONNECTOR, MODULAR JACK, GANGED
товар відсутній
MTJG-2-88ARX1 |
Виробник: Adam Technologies
GANGED MODULAR JACK 1*2PORT 8P8C RA SG RoHS
GANGED MODULAR JACK 1*2PORT 8P8C RA SG RoHS
товар відсутній
MTJG-2-88ARX1-FSM-PG-LG |
Виробник: Adam Technologies
MODULAR TELEPHONE JACK GANGED 8P8C
MODULAR TELEPHONE JACK GANGED 8P8C
товар відсутній
MTJG-2-88ARX1-FSM-PG-LG |
Виробник: Adam Tech
Modular Connectors / Ethernet Connectors CONNECTOR, MODULAR JACK, GANGED
Modular Connectors / Ethernet Connectors CONNECTOR, MODULAR JACK, GANGED
товар відсутній