Продукція > SEEED STUDIO > Всі товари виробника SEEED STUDIO (3137) > Сторінка 53 з 53
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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|---|---|---|---|---|---|---|---|---|---|---|---|
| WHITE LED | SEEED STUDIO | SEEED-104030009 Add-on boards |
на замовлення 2 шт: термін постачання 7-14 дні (днів) |
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Wio-E5-DevKit | Seeed Studio |
Description: HIGH PERFORMANCE:TXOP=22 Packaging: Case For Use With/Related Products: STM32WLE5JC Type: Transceiver; LoRa® (LoRaWAN™) Supplied Contents: Board(s) |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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| WIO TERMINAL | SEEED STUDIO | SEEED-102991299 Microchip development kits |
на замовлення 5 шт: термін постачання 7-14 дні (днів) |
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XIAO ESP32C3 | SEEED STUDIO |
Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-C3; WIFI; XIAO Type of development kit: evaluation Bluetooth version: 5.0 Components: ESP32-C3 Interface: ADC; GPIO; I2C; I2S; SPI; UART Kind of connector: solder pads; U.FL; USB C socket Communictions protocol: WIFI Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: RISC-V Operating temperature: -40...85°C Memory: 400kB SRAM; 4MB FLASH Dimensions: 21x17.5mm WiFi: 2,4GHz Kit contents: prototype board; u.FL antenna |
на замовлення 116 шт: термін постачання 21-30 дні (днів) |
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XIAO ESP32S3 | SEEED STUDIO |
Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-S3R8; WIFI; XIAO Type of development kit: evaluation Bluetooth version: 5.0 Components: ESP32-S3R8 Interface: ADC; GPIO; I2C; I2S; SPI; UART Kind of connector: solder pads; U.FL; USB C socket Communictions protocol: WIFI Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: Xtensa LX7 Operating temperature: -40...65°C Memory: 8MB FLASH; 8MB SRAM Dimensions: 21x17.5mm WiFi: 2,4GHz Kit contents: prototype board; u.FL antenna |
на замовлення 200 шт: термін постачання 21-30 дні (днів) |
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XIAO ESP32S3 SENSE | SEEED STUDIO |
Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-S3R8; WIFI; XIAO Type of development kit: evaluation Bluetooth version: 5.0 Components: ESP32-S3R8 Interface: ADC; GPIO; I2C; I2S; SPI; UART Kind of connector: SD; solder pads; U.FL; USB C socket Communictions protocol: WIFI Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: Xtensa LX7 Operating temperature: -40...65°C Memory: 8MB FLASH; 8MB SRAM Dimensions: 21x17.5mm WiFi: 2,4GHz Kit contents: camera; prototype board; u.FL antenna |
на замовлення 43 шт: термін постачання 21-30 дні (днів) |
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XIAO NRF52840 | SEEED STUDIO |
Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: nRF52840; NFC; XIAO Bluetooth version: 5.0 Interface: ADC; GPIO; I2C; NFC; SPI; SWD; UART Dimensions: 21x17.5mm Kind of connector: solder pads; USB C socket Number of pins: 2x 7 Memory: 256kB SRAM; 2MB FLASH Manufacturer series: XIAO Communictions protocol: NFC Components: nRF52840 Type of development kit: evaluation Kit contents: prototype board Kind of architecture: Cortex M4 |
на замовлення 16 шт: термін постачання 21-30 дні (днів) |
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XIAO NRF52840 SENSE | SEEED STUDIO |
Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: nRF52840; NFC; XIAO Bluetooth version: 5.0 Interface: ADC; GPIO; I2C; NFC; SPI; SWD; UART Dimensions: 21x17.5mm Kind of connector: solder pads; USB C socket Number of pins: 2x 7 Memory: 256kB SRAM; 2MB FLASH Kind of sensor: accelerometer; gyroscope Manufacturer series: XIAO Communictions protocol: NFC Components: nRF52840 Type of development kit: evaluation Programmers and development kits features: MEMS microphone Kit contents: prototype board Kind of architecture: Cortex M4 |
на замовлення 1 шт: термін постачання 21-30 дні (днів) |
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XIAO RP2040 | SEEED STUDIO |
Category: Development kits - others Description: Dev.kit: evaluation; prototype board; Comp: RP2040; XIAO; PIN: 2x7 Type of development kit: evaluation Kit contents: prototype board Components: RP2040 Interface: GPIO; I2C; SPI; SWD; UART Kind of connector: solder pads; USB C socket Dimensions: 21x17.5mm Kind of architecture: Cortex M0+ Number of pins: 2x 7 Memory: 264kB SRAM; 2MB FLASH Manufacturer series: XIAO |
на замовлення 23 шт: термін постачання 21-30 дні (днів) |
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XIAO STARTER KIT | SEEED STUDIO |
Category: Development kits - others Description: Dev.kit: XIAO Starter Kit; XIAO Manufacturer series: XIAO Kit contents: accelerometer module; ambient light sensor; infrared sensor module; LED strip (50xRGB); motion sensor (PIR) module; rotation sensor module; servo; set of diodes; temperature and humidity sensor module; USB cable; wire jumpers Type of development kit: XIAO Starter Kit |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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XIAO ESP32C3 | SEEED STUDIO |
Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-C3; WIFI; XIAO Type of development kit: evaluation Bluetooth version: 5.0 Components: ESP32-C3 Interface: ADC; GPIO; I2C; I2S; SPI; UART Kind of connector: solder pads; U.FL; USB C socket Communictions protocol: WIFI Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: RISC-V Operating temperature: -40...85°C Memory: 400kB SRAM; 4MB FLASH Dimensions: 21x17.5mm WiFi: 2,4GHz Kit contents: prototype board; u.FL antenna кількість в упаковці: 1 шт |
на замовлення 116 шт: термін постачання 7-14 дні (днів) |
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XIAO ESP32S3 | SEEED STUDIO |
Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-S3R8; WIFI; XIAO Type of development kit: evaluation Bluetooth version: 5.0 Components: ESP32-S3R8 Interface: ADC; GPIO; I2C; I2S; SPI; UART Kind of connector: solder pads; U.FL; USB C socket Communictions protocol: WIFI Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: Xtensa LX7 Operating temperature: -40...65°C Memory: 8MB FLASH; 8MB SRAM Dimensions: 21x17.5mm WiFi: 2,4GHz Kit contents: prototype board; u.FL antenna кількість в упаковці: 1 шт |
на замовлення 200 шт: термін постачання 7-14 дні (днів) |
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XIAO ESP32S3 SENSE | SEEED STUDIO |
Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-S3R8; WIFI; XIAO Type of development kit: evaluation Bluetooth version: 5.0 Components: ESP32-S3R8 Interface: ADC; GPIO; I2C; I2S; SPI; UART Kind of connector: SD; solder pads; U.FL; USB C socket Communictions protocol: WIFI Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: Xtensa LX7 Operating temperature: -40...65°C Memory: 8MB FLASH; 8MB SRAM Dimensions: 21x17.5mm WiFi: 2,4GHz Kit contents: camera; prototype board; u.FL antenna кількість в упаковці: 1 шт |
на замовлення 43 шт: термін постачання 7-14 дні (днів) |
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XIAO NRF52840 | SEEED STUDIO |
Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: nRF52840; NFC; XIAO Bluetooth version: 5.0 Interface: ADC; GPIO; I2C; NFC; SPI; SWD; UART Dimensions: 21x17.5mm Kind of connector: solder pads; USB C socket Number of pins: 2x 7 Memory: 256kB SRAM; 2MB FLASH Manufacturer series: XIAO Communictions protocol: NFC Components: nRF52840 Type of development kit: evaluation Kit contents: prototype board Kind of architecture: Cortex M4 кількість в упаковці: 1 шт |
на замовлення 16 шт: термін постачання 7-14 дні (днів) |
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XIAO NRF52840 SENSE | SEEED STUDIO |
Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: nRF52840; NFC; XIAO Bluetooth version: 5.0 Interface: ADC; GPIO; I2C; NFC; SPI; SWD; UART Dimensions: 21x17.5mm Kind of connector: solder pads; USB C socket Number of pins: 2x 7 Memory: 256kB SRAM; 2MB FLASH Kind of sensor: accelerometer; gyroscope Manufacturer series: XIAO Communictions protocol: NFC Components: nRF52840 Type of development kit: evaluation Programmers and development kits features: MEMS microphone Kit contents: prototype board Kind of architecture: Cortex M4 кількість в упаковці: 1 шт |
на замовлення 1 шт: термін постачання 7-14 дні (днів) |
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XIAO RP2040 | SEEED STUDIO |
Category: Development kits - others Description: Dev.kit: evaluation; prototype board; Comp: RP2040; XIAO; PIN: 2x7 Type of development kit: evaluation Kit contents: prototype board Components: RP2040 Interface: GPIO; I2C; SPI; SWD; UART Kind of connector: solder pads; USB C socket Dimensions: 21x17.5mm Kind of architecture: Cortex M0+ Number of pins: 2x 7 Memory: 264kB SRAM; 2MB FLASH Manufacturer series: XIAO кількість в упаковці: 1 шт |
на замовлення 23 шт: термін постачання 7-14 дні (днів) |
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| YELLOW LED BUTTON | SEEED STUDIO | SEEED-111020045 Add-on boards |
на замовлення 1 шт: термін постачання 7-14 дні (днів) |
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| WHITE LED |
Виробник: SEEED STUDIO
SEEED-104030009 Add-on boards
SEEED-104030009 Add-on boards
на замовлення 2 шт:
термін постачання 7-14 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 161.53 грн |
| 20+ | 154.99 грн |
| Wio-E5-DevKit |
Виробник: Seeed Studio
Description: HIGH PERFORMANCE:TXOP=22
Packaging: Case
For Use With/Related Products: STM32WLE5JC
Type: Transceiver; LoRa® (LoRaWAN™)
Supplied Contents: Board(s)
Description: HIGH PERFORMANCE:TXOP=22
Packaging: Case
For Use With/Related Products: STM32WLE5JC
Type: Transceiver; LoRa® (LoRaWAN™)
Supplied Contents: Board(s)
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2597.30 грн |
| WIO TERMINAL |
Виробник: SEEED STUDIO
SEEED-102991299 Microchip development kits
SEEED-102991299 Microchip development kits
на замовлення 5 шт:
термін постачання 7-14 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3262.81 грн |
| XIAO ESP32C3 |
Виробник: SEEED STUDIO
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-C3; WIFI; XIAO
Type of development kit: evaluation
Bluetooth version: 5.0
Components: ESP32-C3
Interface: ADC; GPIO; I2C; I2S; SPI; UART
Kind of connector: solder pads; U.FL; USB C socket
Communictions protocol: WIFI
Manufacturer series: XIAO
Number of pins: 2x 7
Kind of architecture: RISC-V
Operating temperature: -40...85°C
Memory: 400kB SRAM; 4MB FLASH
Dimensions: 21x17.5mm
WiFi: 2,4GHz
Kit contents: prototype board; u.FL antenna
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-C3; WIFI; XIAO
Type of development kit: evaluation
Bluetooth version: 5.0
Components: ESP32-C3
Interface: ADC; GPIO; I2C; I2S; SPI; UART
Kind of connector: solder pads; U.FL; USB C socket
Communictions protocol: WIFI
Manufacturer series: XIAO
Number of pins: 2x 7
Kind of architecture: RISC-V
Operating temperature: -40...85°C
Memory: 400kB SRAM; 4MB FLASH
Dimensions: 21x17.5mm
WiFi: 2,4GHz
Kit contents: prototype board; u.FL antenna
на замовлення 116 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 419.98 грн |
| 3+ | 374.14 грн |
| 10+ | 344.15 грн |
| XIAO ESP32S3 |
Виробник: SEEED STUDIO
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-S3R8; WIFI; XIAO
Type of development kit: evaluation
Bluetooth version: 5.0
Components: ESP32-S3R8
Interface: ADC; GPIO; I2C; I2S; SPI; UART
Kind of connector: solder pads; U.FL; USB C socket
Communictions protocol: WIFI
Manufacturer series: XIAO
Number of pins: 2x 7
Kind of architecture: Xtensa LX7
Operating temperature: -40...65°C
Memory: 8MB FLASH; 8MB SRAM
Dimensions: 21x17.5mm
WiFi: 2,4GHz
Kit contents: prototype board; u.FL antenna
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-S3R8; WIFI; XIAO
Type of development kit: evaluation
Bluetooth version: 5.0
Components: ESP32-S3R8
Interface: ADC; GPIO; I2C; I2S; SPI; UART
Kind of connector: solder pads; U.FL; USB C socket
Communictions protocol: WIFI
Manufacturer series: XIAO
Number of pins: 2x 7
Kind of architecture: Xtensa LX7
Operating temperature: -40...65°C
Memory: 8MB FLASH; 8MB SRAM
Dimensions: 21x17.5mm
WiFi: 2,4GHz
Kit contents: prototype board; u.FL antenna
на замовлення 200 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 853.41 грн |
| 3+ | 763.29 грн |
| 10+ | 686.63 грн |
| XIAO ESP32S3 SENSE |
Виробник: SEEED STUDIO
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-S3R8; WIFI; XIAO
Type of development kit: evaluation
Bluetooth version: 5.0
Components: ESP32-S3R8
Interface: ADC; GPIO; I2C; I2S; SPI; UART
Kind of connector: SD; solder pads; U.FL; USB C socket
Communictions protocol: WIFI
Manufacturer series: XIAO
Number of pins: 2x 7
Kind of architecture: Xtensa LX7
Operating temperature: -40...65°C
Memory: 8MB FLASH; 8MB SRAM
Dimensions: 21x17.5mm
WiFi: 2,4GHz
Kit contents: camera; prototype board; u.FL antenna
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-S3R8; WIFI; XIAO
Type of development kit: evaluation
Bluetooth version: 5.0
Components: ESP32-S3R8
Interface: ADC; GPIO; I2C; I2S; SPI; UART
Kind of connector: SD; solder pads; U.FL; USB C socket
Communictions protocol: WIFI
Manufacturer series: XIAO
Number of pins: 2x 7
Kind of architecture: Xtensa LX7
Operating temperature: -40...65°C
Memory: 8MB FLASH; 8MB SRAM
Dimensions: 21x17.5mm
WiFi: 2,4GHz
Kit contents: camera; prototype board; u.FL antenna
на замовлення 43 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1682.59 грн |
| 3+ | 1526.58 грн |
| 10+ | 1368.25 грн |
| XIAO NRF52840 |
Виробник: SEEED STUDIO
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: nRF52840; NFC; XIAO
Bluetooth version: 5.0
Interface: ADC; GPIO; I2C; NFC; SPI; SWD; UART
Dimensions: 21x17.5mm
Kind of connector: solder pads; USB C socket
Number of pins: 2x 7
Memory: 256kB SRAM; 2MB FLASH
Manufacturer series: XIAO
Communictions protocol: NFC
Components: nRF52840
Type of development kit: evaluation
Kit contents: prototype board
Kind of architecture: Cortex M4
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: nRF52840; NFC; XIAO
Bluetooth version: 5.0
Interface: ADC; GPIO; I2C; NFC; SPI; SWD; UART
Dimensions: 21x17.5mm
Kind of connector: solder pads; USB C socket
Number of pins: 2x 7
Memory: 256kB SRAM; 2MB FLASH
Manufacturer series: XIAO
Communictions protocol: NFC
Components: nRF52840
Type of development kit: evaluation
Kit contents: prototype board
Kind of architecture: Cortex M4
на замовлення 16 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 813.03 грн |
| 3+ | 719.96 грн |
| 10+ | 644.13 грн |
| XIAO NRF52840 SENSE |
Виробник: SEEED STUDIO
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: nRF52840; NFC; XIAO
Bluetooth version: 5.0
Interface: ADC; GPIO; I2C; NFC; SPI; SWD; UART
Dimensions: 21x17.5mm
Kind of connector: solder pads; USB C socket
Number of pins: 2x 7
Memory: 256kB SRAM; 2MB FLASH
Kind of sensor: accelerometer; gyroscope
Manufacturer series: XIAO
Communictions protocol: NFC
Components: nRF52840
Type of development kit: evaluation
Programmers and development kits features: MEMS microphone
Kit contents: prototype board
Kind of architecture: Cortex M4
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: nRF52840; NFC; XIAO
Bluetooth version: 5.0
Interface: ADC; GPIO; I2C; NFC; SPI; SWD; UART
Dimensions: 21x17.5mm
Kind of connector: solder pads; USB C socket
Number of pins: 2x 7
Memory: 256kB SRAM; 2MB FLASH
Kind of sensor: accelerometer; gyroscope
Manufacturer series: XIAO
Communictions protocol: NFC
Components: nRF52840
Type of development kit: evaluation
Programmers and development kits features: MEMS microphone
Kit contents: prototype board
Kind of architecture: Cortex M4
на замовлення 1 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1854.89 грн |
| XIAO RP2040 |
Виробник: SEEED STUDIO
Category: Development kits - others
Description: Dev.kit: evaluation; prototype board; Comp: RP2040; XIAO; PIN: 2x7
Type of development kit: evaluation
Kit contents: prototype board
Components: RP2040
Interface: GPIO; I2C; SPI; SWD; UART
Kind of connector: solder pads; USB C socket
Dimensions: 21x17.5mm
Kind of architecture: Cortex M0+
Number of pins: 2x 7
Memory: 264kB SRAM; 2MB FLASH
Manufacturer series: XIAO
Category: Development kits - others
Description: Dev.kit: evaluation; prototype board; Comp: RP2040; XIAO; PIN: 2x7
Type of development kit: evaluation
Kit contents: prototype board
Components: RP2040
Interface: GPIO; I2C; SPI; SWD; UART
Kind of connector: solder pads; USB C socket
Dimensions: 21x17.5mm
Kind of architecture: Cortex M0+
Number of pins: 2x 7
Memory: 264kB SRAM; 2MB FLASH
Manufacturer series: XIAO
на замовлення 23 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 550.10 грн |
| 3+ | 492.47 грн |
| 10+ | 442.47 грн |
| XIAO STARTER KIT |
Виробник: SEEED STUDIO
Category: Development kits - others
Description: Dev.kit: XIAO Starter Kit; XIAO
Manufacturer series: XIAO
Kit contents: accelerometer module; ambient light sensor; infrared sensor module; LED strip (50xRGB); motion sensor (PIR) module; rotation sensor module; servo; set of diodes; temperature and humidity sensor module; USB cable; wire jumpers
Type of development kit: XIAO Starter Kit
Category: Development kits - others
Description: Dev.kit: XIAO Starter Kit; XIAO
Manufacturer series: XIAO
Kit contents: accelerometer module; ambient light sensor; infrared sensor module; LED strip (50xRGB); motion sensor (PIR) module; rotation sensor module; servo; set of diodes; temperature and humidity sensor module; USB cable; wire jumpers
Type of development kit: XIAO Starter Kit
товару немає в наявності
В кошику
од. на суму грн.
| XIAO ESP32C3 |
Виробник: SEEED STUDIO
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-C3; WIFI; XIAO
Type of development kit: evaluation
Bluetooth version: 5.0
Components: ESP32-C3
Interface: ADC; GPIO; I2C; I2S; SPI; UART
Kind of connector: solder pads; U.FL; USB C socket
Communictions protocol: WIFI
Manufacturer series: XIAO
Number of pins: 2x 7
Kind of architecture: RISC-V
Operating temperature: -40...85°C
Memory: 400kB SRAM; 4MB FLASH
Dimensions: 21x17.5mm
WiFi: 2,4GHz
Kit contents: prototype board; u.FL antenna
кількість в упаковці: 1 шт
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-C3; WIFI; XIAO
Type of development kit: evaluation
Bluetooth version: 5.0
Components: ESP32-C3
Interface: ADC; GPIO; I2C; I2S; SPI; UART
Kind of connector: solder pads; U.FL; USB C socket
Communictions protocol: WIFI
Manufacturer series: XIAO
Number of pins: 2x 7
Kind of architecture: RISC-V
Operating temperature: -40...85°C
Memory: 400kB SRAM; 4MB FLASH
Dimensions: 21x17.5mm
WiFi: 2,4GHz
Kit contents: prototype board; u.FL antenna
кількість в упаковці: 1 шт
на замовлення 116 шт:
термін постачання 7-14 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 503.97 грн |
| 3+ | 466.24 грн |
| 10+ | 412.98 грн |
| XIAO ESP32S3 |
Виробник: SEEED STUDIO
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-S3R8; WIFI; XIAO
Type of development kit: evaluation
Bluetooth version: 5.0
Components: ESP32-S3R8
Interface: ADC; GPIO; I2C; I2S; SPI; UART
Kind of connector: solder pads; U.FL; USB C socket
Communictions protocol: WIFI
Manufacturer series: XIAO
Number of pins: 2x 7
Kind of architecture: Xtensa LX7
Operating temperature: -40...65°C
Memory: 8MB FLASH; 8MB SRAM
Dimensions: 21x17.5mm
WiFi: 2,4GHz
Kit contents: prototype board; u.FL antenna
кількість в упаковці: 1 шт
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-S3R8; WIFI; XIAO
Type of development kit: evaluation
Bluetooth version: 5.0
Components: ESP32-S3R8
Interface: ADC; GPIO; I2C; I2S; SPI; UART
Kind of connector: solder pads; U.FL; USB C socket
Communictions protocol: WIFI
Manufacturer series: XIAO
Number of pins: 2x 7
Kind of architecture: Xtensa LX7
Operating temperature: -40...65°C
Memory: 8MB FLASH; 8MB SRAM
Dimensions: 21x17.5mm
WiFi: 2,4GHz
Kit contents: prototype board; u.FL antenna
кількість в упаковці: 1 шт
на замовлення 200 шт:
термін постачання 7-14 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1024.09 грн |
| 3+ | 951.18 грн |
| 10+ | 823.95 грн |
| XIAO ESP32S3 SENSE |
Виробник: SEEED STUDIO
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-S3R8; WIFI; XIAO
Type of development kit: evaluation
Bluetooth version: 5.0
Components: ESP32-S3R8
Interface: ADC; GPIO; I2C; I2S; SPI; UART
Kind of connector: SD; solder pads; U.FL; USB C socket
Communictions protocol: WIFI
Manufacturer series: XIAO
Number of pins: 2x 7
Kind of architecture: Xtensa LX7
Operating temperature: -40...65°C
Memory: 8MB FLASH; 8MB SRAM
Dimensions: 21x17.5mm
WiFi: 2,4GHz
Kit contents: camera; prototype board; u.FL antenna
кількість в упаковці: 1 шт
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-S3R8; WIFI; XIAO
Type of development kit: evaluation
Bluetooth version: 5.0
Components: ESP32-S3R8
Interface: ADC; GPIO; I2C; I2S; SPI; UART
Kind of connector: SD; solder pads; U.FL; USB C socket
Communictions protocol: WIFI
Manufacturer series: XIAO
Number of pins: 2x 7
Kind of architecture: Xtensa LX7
Operating temperature: -40...65°C
Memory: 8MB FLASH; 8MB SRAM
Dimensions: 21x17.5mm
WiFi: 2,4GHz
Kit contents: camera; prototype board; u.FL antenna
кількість в упаковці: 1 шт
на замовлення 43 шт:
термін постачання 7-14 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2019.11 грн |
| 3+ | 1902.35 грн |
| 10+ | 1641.90 грн |
| XIAO NRF52840 |
Виробник: SEEED STUDIO
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: nRF52840; NFC; XIAO
Bluetooth version: 5.0
Interface: ADC; GPIO; I2C; NFC; SPI; SWD; UART
Dimensions: 21x17.5mm
Kind of connector: solder pads; USB C socket
Number of pins: 2x 7
Memory: 256kB SRAM; 2MB FLASH
Manufacturer series: XIAO
Communictions protocol: NFC
Components: nRF52840
Type of development kit: evaluation
Kit contents: prototype board
Kind of architecture: Cortex M4
кількість в упаковці: 1 шт
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: nRF52840; NFC; XIAO
Bluetooth version: 5.0
Interface: ADC; GPIO; I2C; NFC; SPI; SWD; UART
Dimensions: 21x17.5mm
Kind of connector: solder pads; USB C socket
Number of pins: 2x 7
Memory: 256kB SRAM; 2MB FLASH
Manufacturer series: XIAO
Communictions protocol: NFC
Components: nRF52840
Type of development kit: evaluation
Kit contents: prototype board
Kind of architecture: Cortex M4
кількість в упаковці: 1 шт
на замовлення 16 шт:
термін постачання 7-14 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 975.64 грн |
| 3+ | 897.18 грн |
| 10+ | 772.96 грн |
| XIAO NRF52840 SENSE |
Виробник: SEEED STUDIO
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: nRF52840; NFC; XIAO
Bluetooth version: 5.0
Interface: ADC; GPIO; I2C; NFC; SPI; SWD; UART
Dimensions: 21x17.5mm
Kind of connector: solder pads; USB C socket
Number of pins: 2x 7
Memory: 256kB SRAM; 2MB FLASH
Kind of sensor: accelerometer; gyroscope
Manufacturer series: XIAO
Communictions protocol: NFC
Components: nRF52840
Type of development kit: evaluation
Programmers and development kits features: MEMS microphone
Kit contents: prototype board
Kind of architecture: Cortex M4
кількість в упаковці: 1 шт
Category: Development kits for data transmission
Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: nRF52840; NFC; XIAO
Bluetooth version: 5.0
Interface: ADC; GPIO; I2C; NFC; SPI; SWD; UART
Dimensions: 21x17.5mm
Kind of connector: solder pads; USB C socket
Number of pins: 2x 7
Memory: 256kB SRAM; 2MB FLASH
Kind of sensor: accelerometer; gyroscope
Manufacturer series: XIAO
Communictions protocol: NFC
Components: nRF52840
Type of development kit: evaluation
Programmers and development kits features: MEMS microphone
Kit contents: prototype board
Kind of architecture: Cortex M4
кількість в упаковці: 1 шт
на замовлення 1 шт:
термін постачання 7-14 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2225.87 грн |
| 3+ | 2040.46 грн |
| 10+ | 1761.90 грн |
| XIAO RP2040 |
Виробник: SEEED STUDIO
Category: Development kits - others
Description: Dev.kit: evaluation; prototype board; Comp: RP2040; XIAO; PIN: 2x7
Type of development kit: evaluation
Kit contents: prototype board
Components: RP2040
Interface: GPIO; I2C; SPI; SWD; UART
Kind of connector: solder pads; USB C socket
Dimensions: 21x17.5mm
Kind of architecture: Cortex M0+
Number of pins: 2x 7
Memory: 264kB SRAM; 2MB FLASH
Manufacturer series: XIAO
кількість в упаковці: 1 шт
Category: Development kits - others
Description: Dev.kit: evaluation; prototype board; Comp: RP2040; XIAO; PIN: 2x7
Type of development kit: evaluation
Kit contents: prototype board
Components: RP2040
Interface: GPIO; I2C; SPI; SWD; UART
Kind of connector: solder pads; USB C socket
Dimensions: 21x17.5mm
Kind of architecture: Cortex M0+
Number of pins: 2x 7
Memory: 264kB SRAM; 2MB FLASH
Manufacturer series: XIAO
кількість в упаковці: 1 шт
на замовлення 23 шт:
термін постачання 7-14 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 660.12 грн |
| 3+ | 613.70 грн |
| 10+ | 530.97 грн |
| YELLOW LED BUTTON |
Виробник: SEEED STUDIO
SEEED-111020045 Add-on boards
SEEED-111020045 Add-on boards
на замовлення 1 шт:
термін постачання 7-14 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 338.13 грн |
| 4+ | 328.98 грн |
| 10+ | 310.98 грн |







